Phenylvinyl silicone resin for substrate bonding and its preparation method and application

A technology based on phenylvinyl silicon and vinyl, applied in the direction of adhesives, etc., can solve the problems of light transmittance decrease, mechanical strength decrease, surface stickiness and other problems of LED packaging composition, and achieve good impurity ion content and adhesive strength The effect of improving the bonding strength

Inactive Publication Date: 2018-04-17
SHENZHEN CAPCHEM TECH CO LTD
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, HCl, water glass, KOH and other substances are used in the synthesis process of silicone resin for LED packaging in China, and a large amount of Na, K, Cl and other elements that are harmful to LED chips are often introduced into the reinforcing material, or additional use is required. Tackifier, leading to disadvantages such as a decrease in light transmittance of the composition for LED packaging and sticky surface after curing, the publication number is CN 102690416A, the name is "a high refractive index silicone resin and its preparation method" and the publication number is CN 103232601A , and the two patents titled "Phenyl MDT Silicone Resin and Its Preparation Method", due to the use of water glass, HCl and other raw materials, and no deionization treatment, this will lead to a large number of potential hazards to LED chips in the product In the patent with the publication number CN 1993427A titled "Curable organopolysiloxane composition, its curing method, semiconductor device and adhesion promoter", due to the additional use of tackifier in the LED encapsulant This will lead to problems such as the light transmittance of LED glue, the decrease of mechanical strength, and the surface is easy to stick after curing.
[0005] To sum up, the encapsulants in this field have insufficient bonding strength, so additional tackifiers need to be introduced, which brings about the technical problem of negative impact

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Phenylvinyl silicone resin for substrate bonding and its preparation method and application
  • Phenylvinyl silicone resin for substrate bonding and its preparation method and application
  • Phenylvinyl silicone resin for substrate bonding and its preparation method and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0135] 3.3583g tetramethyldisiloxane (molecular weight 134.33), 6.7658g hexamethyldisiloxane (molecular weight 162.38), 13.98g divinyl tetramethyldisiloxane (molecular weight 186.4), 60g ethanol, 50g Deionized water and 3g of sulfuric acid were added to the reactor, and at 40°C, 128.7g of phenyltrimethoxysilane (molecular weight 198) was added dropwise to the reactor, and after the addition was completed, the temperature was raised to 80°C to continue the reaction for 6 hours; An equal volume of toluene was added to the finished mixed solution for extraction, and washed 5 times with deionized water until the pH value was close to neutral, and then anhydrous CaCl 2 Put it into the toluene solution of silicone resin to remove the moisture in the solution; add 5.5g of cation exchange resin Amberlyst15Dry to the toluene solution of the obtained silicone resin, react at 90°C for 8h, filter to remove the cation exchange resin, and then Remove the solvent and low boilers under reduce...

Embodiment 2

[0138] 2.6866g tetramethyldisiloxane (molecular weight 134.33), 9.4721g hexamethyldisiloxane (molecular weight 162.38), 5.592g divinyl tetramethyldisiloxane (molecular weight 186.4), 60g ethanol, 50g Deionized water and 20g of acetic acid were added to the reactor, and at 40°C, 108.9g of phenyltrimethoxysilane (molecular weight 198) was added dropwise to the reactor, and after the addition was completed, the temperature was raised to 50°C to continue the reaction for 8 hours; An equal volume of toluene was added to the finished mixed solution for extraction, and washed 4 times with deionized water until the pH value was close to neutral, and then anhydrous CaCl 2 Put it into the toluene solution of silicone resin to remove the moisture in the solution; add 5.5g phosphazene chloride to the toluene solution of the obtained silicone resin, react at 80°C for 1h, and then remove the solvent under reduced pressure at 170°C and low boilers to obtain a solid silicone resin containing ...

Embodiment 3

[0141] 4.0299g tetramethyldisiloxane (molecular weight 134.33), 12.9904g hexamethyldisiloxane (molecular weight 162.38), 12.42g dimethyldivinyldiphenyldisiloxane (molecular weight 310.54), 60g Add ethanol, 50g of deionized water, and 3g of trifluoromethanesulfonic acid into the reactor, and add 99g of phenyltrimethoxysilane (molecular weight: 198) dropwise to the reactor at 40°C, and raise the temperature to 70°C after the addition is completed The reaction was continued for 10 h; an equal volume of p-xylene was added to the mixed solution after the reaction for extraction, and deionized water was used to wash 3 times until the pH value was close to neutral, and then anhydrous CaCl 2 Put it into the toluene solution of silicone resin to remove the moisture in the solution; add 5.5HZSM-5 molecular sieve to the obtained p-xylene solution of silicone resin, react at 70°C for 6h, filter to remove the molecular sieve, and then in 170°C Remove the solvent and low boilers under reduc...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
lengthaaaaaaaaaa
refractive indexaaaaaaaaaa
Login to View More

Abstract

The invention discloses a phenyl vinyl silicone resin for substrate bonding and its preparation method and application. The phenyl vinyl silicone resin is composed of a solid silicone resin containing Si-H, a methyl group, a phenyl group and a vinyl group and An organic compound containing a tackifying group and a vinyl group is produced through a hydrosilylation reaction under the action of a hydrosilylation catalyst, wherein the tackifying group refers to a compound that enhances the bonding ability with the substrate organic group. When the phenylvinyl silicone resin provided by the present invention is used as a reinforcing and adhesion-promoting material in LEDs, it can provide LED encapsulation glue with high hardness, high toughness, high refractive index and higher light efficiency, and has good properties for various substrates. Excellent bonding ability, and can make the material have strong reliability during use, and have very strong practicability.

Description

technical field [0001] The invention relates to the technical field of substrate encapsulation adhesives, in particular to the technical field of LED encapsulation adhesives, in particular to a phenyl vinyl silicone resin for substrate bonding with good adhesion to the substrate, a preparation method and application thereof. Background technique [0002] In recent years, LED (Light Emitting Diode, light-emitting diode), as a semiconductor light-emitting device, has been widely used in lighting, backlight, display and other fields due to its advantages of energy saving, long life, environmental protection, and high light efficiency. The electric energy is only 1 / 10 of the traditional light source. If the LED light source can be used instead of the traditional light source, it will greatly reduce the world's energy consumption rate. [0003] At present, polysiloxane has replaced traditional epoxy resin and has become the mainstream material for LED packaging. Polysiloxane has ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & AuthorityPatents(China)
IPC IPC(8): C08G77/38C09J183/07C09J183/05C09J183/04
Inventor赵大成马子淇
OwnerSHENZHEN CAPCHEM TECH CO LTD