Aluminum carbide silicon carbide composite molding device and manufacturing method using the same

Abstract

The present invention relates to a device for molding an aluminum / silicon carbide composite and a manufacturing method using the same. A device for molding an aluminum / silicon carbide composite and a manufacturing method using the same, according to an embodiment of the present invention, are characterized in that the molding device impregnates a preliminary molded body of a silicon carbide material with molten aluminum alloy under pressure, thereby molding an aluminum / silicon carbide composite, and the molding device comprises: a molding unit provided in the shape of a frame for containing the preliminary molded body and impregnating the same under pressure such that, when the preliminary molded body is contained therein and is pressurized while being impregnated with the inflowing molten aluminum alloy, a side surface of the preliminary molded body is deformed, the center thereof protrudes, and bending occurs and reduces the sectional area towards each edge; pressurization molten metal arranged such that the molding unit is contained, the pressurization molten metal having an impregnation space therein as a space having an upper opening such that the molten aluminum alloy flows into the molding unit, in which the preliminary molded body is contained, thereby containing the same under pressure while being impregnated with the molten aluminum alloy; and a pressurization unit arranged on the upper portion of the pressurization molten metal, the pressurization unit providing a pressurization force to the impregnation space such that, while moving up / down, the molding unit is pressurized while being impregnated with the molten aluminum alloy.

Description

technical field [0001] The present invention relates to an aluminum-silicon carbide composite forming device and a manufacturing method using the same, and more particularly relates to a method for manufacturing an aluminum-silicon carbide composite in which a spacer is provided to form a silicon carbide pressurized plate-shaped When impregnating and molding the curved space in the molding die, when the silicon carbide-based material is impregnated with molten aluminum and pressurized, the space in the partition part is curved, and no other process based on bending molding is required. This increases productivity. Background technique [0002] Generally, in various electronic components such as power insulated gate bipolar transistors (IGBT, insulated gate bipolar modetransistor), power control chips (power control chips), high-power light-emitting diodes (LEDs) for lighting, etc., the problem of heat dissipation becomes very important. The problem. In order to solve such ...

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Problems solved by technology

[0009] As mentioned above, the manufacturing method of the Al-SiC composite body having the amount of bending in the conventional technology is formed and bent in a subsequent process after the pressure impregnation is completed, and the Al-SiC composite body itself is very hard, so it should be carried out by using tools such as diamonds. cutting, it is difficult to process the correct curved shape, and the problem is that the cost is high

[0010] In addition, another manufacturing method of an aluminum-silicon carbide composite body having a bending amount in the prior art is to press-impregnate a plate-shaped silicon carbide with an aluminum alloy layer, and then perform a secondary bending process after forming a curved position to be thick. When the overall aluminum layer becomes thicker and used as a substrate, there is a problem that the thermal expansion coefficient becomes larger

[0011] That is, in the secondary processing for bending forming of a thickly formed aluminum alloy layer, processing for removing the aluminum alloy layer is performed, and during the removal of the aluminum alloy layer, if the If the silicon carbide composites are in contact with each other, the processing device will be damaged. A certain thickness of the aluminum alloy layer should be maintained, and it should be used as a reference to determine the thickness of the central part. There is a problem that the coefficient of thermal expansion becomes high

[0012] In addition, another manufacturing method of an aluminum-silicon carbide composite body having a bending amount in the prior art is to process and bend the aluminum-silicon carbide composite body by post-processing using a high-temperature pressurization process in the state of producing the aluminum-silicon carbide composite body. The physical properties of the aluminum alloy impregnated in the voids change, and there is a problem that the hardness decreases and the durability decreases.

[0013] In addition, when the aluminum-silicon carbide composite is manufactured into a substrate by a high-temperature pressurization process, the entire surface is pressurized and warped, and there is a problem that it is difficult to control the amount of warping required by the user.

[0014] That is, in order to minimize high-temperature deformation when installing the substrate, bending should only occur on the fixed installation surface, but using the high-temperature pressurization process, it will also occur on the opposite surface to the installation surface, that is, the substrate surface on which various components are mounted. There is a problem that it is difficult to install parts due to bending, and it is difficult to maintain an electrical connection between the installed parts

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