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Touch panel, bonding structure, and flexible printed circuit board

A flexible circuit board and touch panel technology, which is applied to the input/output process of electrical digital data processing, instruments, and data processing, etc. Problems such as cracks are observed, and the method is simple and intuitive, avoiding sample loss and saving costs.

Active Publication Date: 2015-11-11
INTERFACE OPTOELECTRONICS SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since these pins are made of opaque conductive metal materials, it is difficult to observe the cracking of the conductive particles in the anisotropic conductive film after the sensing substrate and the flexible circuit board are bonded, so it is not easy to obtain Sensing the conduction state of the substrate and the flexible circuit board

Method used

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  • Touch panel, bonding structure, and flexible printed circuit board
  • Touch panel, bonding structure, and flexible printed circuit board
  • Touch panel, bonding structure, and flexible printed circuit board

Examples

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Embodiment Construction

[0019] Please also refer to figure 1 and figure 2 , figure 1 It is a schematic structural diagram of a touch panel provided by a preferred embodiment of the present invention. figure 2 for figure 1 Partial enlarged view of area II in the middle touch panel. The touch panel 1 can be applied to touch display devices, such as smart phones, tablet computers, game consoles or electronic dictionaries. The touch panel 1 includes a sensing substrate 11, a flexible circuit board (FPC) 12, an anisotropic conductive film 13 (ACF, see image 3 ) and touch drive circuit 14.

[0020] The sensing substrate 11 includes a sensing structure 111 for sensing user's touch information, the sensing substrate 11 defines a touch area 110a and a frame area 110b, the touch area 110a is a touch display area, and the frame area 110b surrounds the touch area 110a. The frame area 110b further defines a bonding area B, and a group of first pins 1121 arranged in parallel are disposed in the bonding a...

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PUM

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Abstract

The present invention relates to a touch panel. A group of first pins, a flexible printed circuit board comprising a group of second pins, and an anisotropic conductive film arranged between the group of first pins and the group of second pins are disposed in a bonding area of the touch panel. A group of first blanking intervals are defined in an interval between two adjacent first pins. A group of second blanking intervals are defined in an interval between two adjacent second pins. A width of at least one blanking interval in one of the group of first blanking intervals and the group of second blanking intervals is greater than widths of other blanking intervals, and at least one pin of the group of first pins and the group of the second pins is disposed by corresponding to the blanking interval with the greater width. According to the present invention, when electrical detection is performed on the touch panel, rupture of a conductive particle may be observed by using the blanking interval with the greater width, to determine a bonding situation.

Description

technical field [0001] The invention relates to a touch panel, a bonding structure and a flexible circuit board. Background technique [0002] A touch panel generally includes a sensing substrate for sensing user touch information, a flexible printed circuit board (Flexible Printed Circuit Board, FPC) for transmitting the touch information to a control device, and connecting pins on the sensing substrate to the Each pin of the flexible circuit board realizes the anisotropic conductive film (Anisotropic Conductive Film, ACF) that is electrically connected. However, since these pins are made of opaque conductive metal materials, it is difficult to observe the cracking of the conductive particles in the anisotropic conductive film after the sensing substrate and the flexible circuit board are bonded, so it is not easy to obtain Know the conduction state of the sensing substrate and the flexible circuit board. Contents of the invention [0003] In view of the above, it is ne...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F3/041
Inventor 武刚
Owner INTERFACE OPTOELECTRONICS SHENZHEN