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heat pump

A heat pump and thermal operation technology, applied in the field of heat pumps, can solve problems such as complex inflow structures of heat exchangers

Inactive Publication Date: 2018-01-23
LG ELECTRONICS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] Heat pumps in the prior art have the problem that a separate defrosting heater is required, or that heating operation cannot be temporarily interrupted to continue heating, or that the inflow structure for partial defrosting of the heat exchanger is complicated

Method used

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Embodiment Construction

[0039] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

[0040] figure 1 It is a diagram showing the flow of refrigerant during the heating operation of the first embodiment of the heat pump of the present invention, figure 2 It is a diagram showing the flow of refrigerant during the cooling operation of the first embodiment of the heat pump of the present invention, image 3 For a plan view showing the interior of the outdoor unit of the first embodiment of the heat pump of the present invention, Figure 4 It is a diagram showing the inside of the second heat exchanger of the first embodiment of the heat pump of the present invention.

[0041] The heat pump in this embodiment includes: a first circulation device 2, which circulates the first refrigerant; and a second circulation device 4, which circulates the second refrigerant. exchange.

[0042] The first cycle device 2 may be a refrigeration cycle device incl...

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Abstract

The heat pump includes: a first circulation device, which circulates the first refrigerant sequentially through the first compressor, the four-way valve, the first heat exchanger, the second heat exchanger, the first expansion mechanism, and the third heat exchanger during heating , four-way valve, and the first compressor. When cooling, the first refrigerant is circulated sequentially through the first compressor, the four-way valve, the third heat exchanger, the first expansion mechanism, the second heat exchanger, and the first heat exchanger , four-way valve and the first compressor; the second circulation device, so that the second refrigerant circulates in turn the second compressor, the fourth heat exchanger, the second expansion mechanism, the second heat exchanger and the second compressor, the second One of the heat exchanger and the second heat exchanger is a first refrigerant flow path through which the first refrigerant passes and a second refrigerant flow path through which the second refrigerant passes and exchanges heat with the first refrigerant. Refrigerant-second refrigerant heat exchanger. The heat pump also includes an outdoor fan that sequentially passes outdoor air through the fourth heat exchanger and the third heat exchanger.

Description

technical field [0001] The invention relates to a heat pump, in particular to a heat pump capable of continuous heating. Background technique [0002] In general, a heat pump is a cooling and heating device that transfers a low-temperature heat source to a high temperature or transfers a high-temperature heat source to a low temperature by using the heating or condensation heat of a refrigerant. [0003] The heat pump can include a compressor, an outdoor heat exchanger, an expansion mechanism, and an indoor heat exchanger, and can heat or cool indoors. [0004] When performing cooling operation, the outdoor heat exchanger of the heat pump can function as a condenser, and the indoor heat exchanger can function as an evaporator. When performing heating operation, the indoor heat exchanger of the heat pump can function as a condenser. A heat exchanger can function as an evaporator. [0005] When the compressor is driven, moisture in the air can be condensed on the surface of ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F25B30/06
CPCF25B7/00F25B13/00F25B47/02F25B49/02F25B2313/0254F25B2600/0251F25B49/022F25D21/12F25B6/02F25B30/02
Inventor 金起东河钟哲张支元金铉宗
Owner LG ELECTRONICS INC