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High-density server accommodating multiple modules and computer

一种计算机、存储模块的技术，应用在计算、仪器、支撑结构上的电路布置等方向，能够解决增大计算机空的空间量等问题

Inactive Publication Date: 2015-11-25
NEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this may increase the amount of empty space in your computer

Method used

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  • High-density server accommodating multiple modules and computer
  • High-density server accommodating multiple modules and computer
  • High-density server accommodating multiple modules and computer

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0032] figure 1 is a perspective view showing the configuration of the computer 1 according to the first embodiment of the present invention. The computer 1 includes a substrate 2, a connector 3, and modules 4 (ie 4a, 4b). For example, computer 1 is suitable for a complex high-density server incorporating multiple server units.

[0033] The substrate 2 is configured from a PCB (Printed Circuit Board) or the like. The substrate 2 is installed in a housing (not shown). The substrate 2 includes printed lines (not shown) connected to the connector 3 . As the substrate 2, a multilayer printed circuit board can be used. In addition, the substrate 2 includes a power supply line (not shown) configured to supply driving power to the module 4 . The power cord is connectable to the module 4 via the connector 3 .

[0034] Fix the connector 3 on the substrate 2 . The connector 3 can be electrically connected with the module 4 while mechanically supporting the module 4 . The connect...

no. 3 example

[0052] Next, refer to image 3 A computer 201 according to a third embodiment of the present invention will be described. The computer 201 differs from the computer 101 in that the connectors 3 are arranged in a two-dimensional array defined by the first and second directions D1 and D2. exist image 3 , use the same reference notation to specify the figure 1 and figure 2 The same parts as those shown.

[0053] image 3 is a plan view of a computer 201 according to a third embodiment of the present invention. The computer 201 includes a substrate 2, a connector 3, and modules ( image 3 not shown). The module 4 has the same configuration as that used in the first and second embodiments; therefore, description thereof will be omitted.

[0054] A plurality of connectors are fixed on the substrate 2 . The connectors 3 are arranged in a two-dimensional array so that the connectors 3 of the first set are arranged in each row corresponding to the first direction D1, and the...

no. 4 example

[0060] Next, refer to Figure 5 A computer 301 according to a fourth embodiment of the present invention will be described. The computer 301 differs from the computer 101 in that the first module 4a is configured to control electronic equipment mounted on the second module 4b. exist Figure 5 , use the same reference notation to specify the Figure 1 to Figure 3 The same parts as those shown; therefore, repeated descriptions thereof will be omitted.

[0061] Figure 5 is a front view of a computer 301 according to a fourth embodiment of the present invention. The computer 301 includes two types of modules 4, namely one first module 4a and two second modules 4b. The first module 4a includes a controller 9 capable of outputting control signals through the electrodes 5 of the connector 3 attached to the first module 4a.

[0062] The second module 4 b comprises an electronic device 10 controlled by a controller 9 . The second modules 4b may include electronic devices 10 hav...

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Abstract

A computer, serving as a high-density server, includes a substrate, a plurality of connectors each including a plurality of electrodes, and a plurality of modules detachably attached to the substrate via connectors. The modules are attached to the connectors via different combinations of electrodes such that a first module (e.g. a CPU) is attached to one connector via a first combination of electrodes while a second module (e.g. a storage module or an attachment module) is attached to another connector via a second combination of electrodes. The connectors are aligned in a first direction on the substrate or in an array defined by first and second directions perpendicular to each other, wherein the connectors are selectively and electrically connected together with electrodes.

Description

technical field [0001] The present invention relates to high density servers and computers housing multiple modules. [0002] This application claims priority from Japanese Patent Application No. 2014-100281, the entire contents of which are hereby incorporated by reference. Background technique [0003] Computers that include multiple modules in a single housing have been developed and designed to include such features as slots connectable to CPU modules, slots connectable to memory modules, and slots connectable to I / O modules. Multiple types of slots that accommodate multiple types of modules. [0004] Various technologies related to computers and high-density servers have been disclosed in various documents. Patent Document 1 discloses a configuration management method of an ATM electronic switching system configured to incorporate high-speed interface encapsulation or low-speed interface encapsulation therein. The ATM electronic switching system includes a controller...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/18G06F13/40
CPCY10T29/49906G06F1/18G06F2200/1635G06F1/183H05K7/10G06F1/28
Inventor 佐藤祐
Owner NEC CORP