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Cooling device assembly with control valve and top pressure springs for electric power well in building

A technology of cooling device and top pressure spring, which is applied in the direction of electrical components, etc., can solve the problems of complex structure of cooling device, safety risk of building electricity use, difficulty in heat dissipation of cooling device, etc., to avoid unstable factors, compact structure, and reduce local overheating area effect

Inactive Publication Date: 2015-11-25
林燕萍
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This uneven heat build-up has a damaging effect on the insulation on the cable surface and poses a potential risk to the electrical safety of the entire building
[0004] It is difficult for the existing cooling device to dissipate heat at the heat concentration point, or the structure of the cooling device is too complicated

Method used

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  • Cooling device assembly with control valve and top pressure springs for electric power well in building
  • Cooling device assembly with control valve and top pressure springs for electric power well in building

Examples

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Embodiment Construction

[0011] Combine below Figure 1-2 The present invention will be described in detail.

[0012] According to an embodiment, a cooling device assembly for a power well in a building with a control valve and a pressure spring includes a plurality of cooling devices separately arranged along the vertical direction of the power well and supplied with gas by a gas delivery pipe 61, Each cooling device includes a cooling device body 82 and fixing brackets 100 arranged on both sides of the cooling device body 82 for fixing on two opposite side walls 102 of the power well, and the fixing brackets 100 are provided with The cable fixing hole 103 for the power cable 1030 to pass through, the cooling device body 82 includes an annular cavity housing 15 provided with a gas inlet nozzle 6 to communicate with the gas delivery pipe 61, the gas inlet pipe A control valve 26 is provided on the nozzle 6 to control the gas supply volume of the gas inlet nozzle 6, the control valve 26 is an electrom...

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Abstract

The invention relates to a cooling device assembly with a control valve and top pressure springs for an electric power well in a building. The cooling device assembly comprises a plurality of cooling devices which are separately arranged along the vertical direction of the electric power well, and is characterized in that a gas delivering pipe (61) provides gas for the cooling devices, each cooling device comprises a cooling device body (82) and fixed brackets (100) which are arranged at two sides of the cooling device body (82) and used for being fixed on two opposite side walls (102) of the electric power well respectively, each fixed bracket (100) is internally provided with cable fixing holes (103) provided for electric power cables (1030) to pass through, each cooling device body (82) comprises an annular cavity shell (15) which is provided with a gas inlet pipe nozzle (6) so as to be communicated with the gas delivering pipe (61), the gas inlet pipe nozzle (6) is provided with a control valve (26) so as to be used for controlling the gas supply amount of the gas inlet pipe nozzle (6), and the control valve (26) is an electromagnetic control valve.

Description

technical field [0001] The application relates to the construction field, in particular to a cooling device assembly for a power well in a building with a control valve and a pressure spring. Background technique [0002] In the building, in order to uniformly supply power to the electrical equipment on each floor, a power well is often provided to allow power cables to pass between floors. In order to discharge the heat generated by the cables in the power well in time and ensure the safety of electricity use, the power well is usually provided with a common exhaust pipe to discharge the heat uniformly. [0003] During the long-term use of power cables, the power consumption of each floor is different, and the different structures that the cables pass through and the different changes in the quality of the cables will cause concentrated heat accumulation in the cable bundle. This uneven heat accumulation has a damaging effect on the insulation layer on the surface of the c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H02G3/03
Inventor 胡丽春
Owner 林燕萍
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