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Production method of electronic potting glue

A production method and technology of potting glue, applied in the directions of mixing methods, chemical instruments and methods, dissolution, etc., can solve the problems of labor and time resources, long production cycle, complex production methods, etc., to improve production efficiency and production cycle. Short, productive results

Active Publication Date: 2018-02-06
兆舜科技(广东)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The existing production methods of electronic potting adhesives are complicated, the production cycle is long, and it consumes a lot of manpower and time resources.

Method used

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  • Production method of electronic potting glue
  • Production method of electronic potting glue
  • Production method of electronic potting glue

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Embodiment Construction

[0038] The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and through specific implementation methods.

[0039] Such as Figure 1~5 As shown, in this embodiment, a method for producing electronic potting glue according to the present invention includes the following steps:

[0040] Step S100, providing a feeding device, through which the required production raw materials are provided for subsequent production;

[0041] Step S200, providing a high-speed mixer 3, and feeding raw materials into the high-speed mixer 3 through the feeding device;

[0042] Step S300, stirring for the first time, performing the first stirring on the production raw materials put into the high-speed mixer 3 to make them uniformly mixed and heated up;

[0043] Step S400, cooling, so that the production raw materials that have been stirred for the first time pass through the cooling system, and the cooling system cools them;

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PUM

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Abstract

The invention discloses a method for producing electronic potting glue, comprising the following steps: step S100, providing a feeding device, and providing required production raw materials for subsequent production through the feeding device; step S200, providing a high-speed mixer, and feeding the high-speed mixer into the high-speed mixer through the feeding device Raw material production; step S300, stirring for the first time, stirring the raw materials put into the high-speed mixer for the first time to make them uniformly mixed and heating up; step S400, cooling, making the raw materials stirred for the first time pass through the cooling system, The cooling system cools it; step S500, adding additives, mixing the cooled semi-finished raw materials and additives to form electronic potting adhesive products; step S600, subpackaging, subpackaging electronic potting adhesive products according to the set weight . The production method of the electronic potting glue of the present invention has short production period, high production efficiency of the electronic potting glue, high degree of automation, can save manpower, and improve production efficiency.

Description

technical field [0001] The invention relates to the technical field of potting glue preparation, in particular to the production of electronic potting glue, in particular to a production method of electronic potting glue. Background technique [0002] Potting glue, also known as electronic glue, is used for bonding, sealing, potting and coating protection of electronic components. After the potting glue is completely cured, it can play waterproof, moisture-proof, dust-proof, insulation, heat conduction, confidentiality, corrosion resistance, With the functions of temperature resistance and shock resistance, potting glue has been widely used in the electronic device manufacturing industry, and is an indispensable and important insulating material for the electronic industry. The potting glue is liquid before it is cured and has fluidity. The viscosity of the glue varies according to the material, performance and production method of the product. Only when the potting glue is...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B01F3/14B01F23/57
Inventor 赵应岩欧阳国涛
Owner 兆舜科技(广东)有限公司