Trans-scale geometrical parameter measurement method based on microscopic visual sense

Abstract

The invention discloses a trans-scale geometrical parameter measurement method based on microscopic visual sense, belongs to the technical field of computer vision measurement, and relates to a measurement method suitable for the spatial position, physical dimension and form and location tolerance of three-dimensional trans-scale parts of a graph type. The method employs a binocular microscopic visual system to collect a characteristic image of a to-be-measured part, and finally achieves the quick measurement of geometrical parameters through three steps: microscopic visual calibration, image characteristic extracting and matching, and local coordinate system and machine coordinate system resolving. The method employs a mode of combining a numerical control machine tool with microscopic visual sense, and solves problems that a measurement process is tedious and the measurement is difficult because of large size span of parts. The method employs non-contact measurement, is simple in operation, cannot damage a workpiece, and achieves the on-machine measurement of the workpiece. The method prevents a secondary clamping error caused by the disassembly of the workpiece from affecting measurement results, finally achieves the accurate and quick on-machine measurement of trans-scale parts.

Description

technical field [0001] The invention belongs to the technical field of computer vision measurement, and relates to a method for measuring the spatial position and geometric size of three-dimensional cross-scale graphic parts. Background technique [0002] With the rapid development of aviation, aerospace, and microelectronics, various functional parts are developing in the direction of 100μm-10m, such as spacecraft solid-surface antenna reflectors, ultra-wideband Signal transmitter / receiver, various multi-functional circuit boards, etc. are widely used in various fields. However, the manufacturing accuracy of such parts is required to be as high as the micron level, which not only imposes requirements on precision manufacturing technology, but also poses challenges to existing precision measurement technology; moreover, in order to ensure the function, such parts must have both small features and large dimensions The structure makes the measurement span large, which increas...

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Problems solved by technology

[0004] The technical problem to be solved by the present invention is to overcome the defects of the prior art, and to invent a method for measuring cross-scale geometric parameters based on microscopic vision, so as to solve the problems of difficult measurement of graphic parts due to the three-dimensional structure of space, the large span of characteristic dimensions

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