MEMS pressure sensor

A pressure sensor and ASIC chip technology, applied in the direction of measuring fluid pressure, instruments, measuring force, etc., can solve the problems affecting the measurement accuracy of the chip, and achieve the effect of reducing the impact

Inactive Publication Date: 2015-12-30
AAC ACOUSTIC TECH (SHENZHEN) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, MEMS pressure sensor chips and ASIC chips are generally mounted directly on circuit boards, which greatly affects the measurement accuracy of the chips when they are impacted by external forces.

Method used

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Embodiment Construction

[0014] The present invention will be further described below with reference to the drawings and embodiments.

[0015] reference figure 1 with figure 2 , The MEMS pressure sensor 100 provided by the first embodiment of the present invention includes a circuit board 10, a housing 20 covered on the circuit board 10 and combined with the circuit board 10 to form a housing space 200, and a MEMS pressure sensor housed in the housing space 200 Chip 30 and ASIC chip 40. In this embodiment, the MEMS pressure sensor chip 30 and the ASIC chip 40 are arranged on the circuit board 10 side by side and spaced apart, and the electrical connection between the three is achieved by bonding gold wires 50.

[0016] The housing 20 includes a top wall 201 disposed directly opposite to the circuit board 10 and a side wall 202 formed by bending and extending along the edge of the top wall 201. The housing 20 is connected to the circuit board 10 through the side wall 202. The side wall 202 is provided w...

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PUM

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Abstract

The invention provides an MEMS pressure sensor. The MEMS pressure sensor comprises a circuit board, a shell, an MEMS pressure sensor chip and an ASIC chip, wherein the shell and the circuit board are assembled to form containing space, and the MEMS pressure sensor chip and the ASIC chip are installed on the circuit board. An air hole is formed in the shell. The circuit board comprises an installing area where at least one chip is installed and a non-installing area surrounding the installing area. An annular groove surrounding the installing area is formed in the non-installing area. As the groove is formed in the periphery of the area, where the MEMS chip and / or the ASIC chip are / is installed, of a substrate, the function of buffering pressure is achieved, it is avoided that external stress directly acts on the MEMS pressure sensor chip and / or the ASIC chip, and influences of external force impacting on the measurement accuracy of the sensor are further reduced.

Description

【Technical Field】 [0001] The invention relates to a pressure sensor, in particular to a MEMS pressure sensor. 【Background technique】 [0002] With the rapid development of science and technology, intelligent portable electronic devices have gradually become popular, such as smart phones, smart bracelets, smart hands, and tablet computers. While continuously pursuing the intelligentization of portable electronic devices, users pay more attention to the need for portable electronic devices to have a rich and colorful user experience. At present, more and more manufacturers place pressure sensors in portable electronic devices, and the pressure sensors are usually strain sensors, but the measurement accuracy of the strain sensors is low. [0003] The MEMS pressure sensor provided in the prior art includes a circuit board, a housing that cooperates with the circuit board to form an accommodation space, and a MEMS pressure sensor chip and an ASIC chip accommodated in the accommodation ...

Claims

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Application Information

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IPC IPC(8): G01L1/00G01L19/00
Inventor 张睿康婷
Owner AAC ACOUSTIC TECH (SHENZHEN) CO LTD
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