The invention relates to a solder wire soldering flux capable of reducing splashing and a preparation method thereof. The soldering flux is composed of the following components in percentage by weightof 1.0-10.0% of compound organic acid, 0.2-5.0% of compound activator, 0.1-1.0% of compound defoamer, 2.0-10.0% of compound solvent, 0.1-1.0% of antioxidant, 0.1-1.0% of corrosion inhibitor and the balance of compound rosin. The preparation method comprises the following steps of heating, stirring and melting the compound rosin, adding the compound organic acid and the low-melting-point indissolvable activator, adding the solution dissolved with the high-melting-point dissolvable activator, the antioxidant and the corrosion inhibitor, finally adding the compound defoamer, performing continuous stirring at the constant temperature of 145-165 DEG C, performing full dissolving, and performing uniform mixing, thereby obtaining the soldering flux. The soldering flux is high in activity, easy to tin during welding, low in corrosion, small in residue and high in insulation resistance, the splashing number and the splashing distance of the soldering flux and tin beads in the welding process of a lead-free tin wire can be greatly reduced, the RoHS instruction is met, and the reliability of electronic and electrical products after welding is guaranteed.