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Electronic component and method for dissipating heat from a semiconductor die

A technology of electronic components and semiconductors, applied in semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., can solve problems such as reducing device performance

Active Publication Date: 2018-09-18
INFINEON TECH AUSTRIA AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Excessive heat may degrade device performance

Method used

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  • Electronic component and method for dissipating heat from a semiconductor die
  • Electronic component and method for dissipating heat from a semiconductor die
  • Electronic component and method for dissipating heat from a semiconductor die

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Embodiment Construction

[0015] In the following detailed description, reference is made to the accompanying drawings which form a part hereof, and in which are shown by way of illustration specific embodiments in which the invention may be practiced. In this regard, directional terms such as "top", "bottom", "front", "rear", "front", "rear", etc. are used with reference to the orientation of the figures being described. Because components of the embodiments are positioned in several different orientations, directional terminology is used for purposes of illustration and is not limiting in any way. It is to be understood that other embodiments may be utilized and structural or logical changes may be made without departing from the scope of the present invention. The following detailed description thereof is not taken in a limiting sense, and the scope of the invention is defined by the appended claims.

[0016] Several embodiments will be described below. In this case, identical structural features ...

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Abstract

Embodiments of the present disclosure relate to electronic components and methods for dissipating heat from a semiconductor die. In an embodiment, an electronic component includes a dielectric core layer having a thickness, at least one semiconductor embedded in the dielectric core layer and electrically coupled to at least one contact pad disposed on a first side of the dielectric core layer A die, and a heat sink layer disposed on the second side of the dielectric core layer and thermally coupled to the semiconductor die. The thickness of the semiconductor die is substantially equal to or greater than or equal to the thickness of the dielectric core layer. The heat dissipation layer includes a material having substantially isotropic thermal conductivity.

Description

technical field [0001] The present disclosure relates to electronic components and methods for dissipating heat from a semiconductor die. Background technique [0002] Semiconductor devices can generate heat during operation. Excessive heat may degrade device performance. One approach to reducing the effect of excess heat on device performance is to provide additional heat dissipation components that are thermally coupled to the heat-generating semiconductor device and configured to dissipate the heat away from the semiconductor device. Contents of the invention [0003] In an embodiment, an electronic component includes a dielectric core having a thickness, at least one semiconductor embedded in the dielectric core and electrically coupled to at least one contact pad disposed on a first side of the dielectric core A die, and a heat sink layer disposed on the second side of the dielectric core layer and thermally coupled to the semiconductor die. The thickness of the se...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/31H01L23/48H01L23/373
CPCH01L23/145H01L23/36H01L23/49844H01L23/5389H01L23/051H01L2924/13055H01L2924/13091H01L23/3114H01L24/19H05K1/185H01L2224/32245H01L2224/73267H01L2924/00H01L23/49562H01L2224/32057H01L24/32H01L21/56H01L23/3107H01L23/367H01L23/481H01L24/03H01L24/05H01L2224/0502
Inventor M·斯坦丁M·波雷
Owner INFINEON TECH AUSTRIA AG