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Degassing device in magnetron DC sputtering system

A DC sputtering and degassing device technology, applied in sputtering plating, ion implantation plating, metal material coating process, etc., can solve the problem that the degassing effect is difficult to be guaranteed

Active Publication Date: 2018-04-06
SUZHOU SAISEN ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the lower end surface of the material is always in contact with the conveyor belt during the transmission process, it is difficult to guarantee the degassing effect

Method used

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  • Degassing device in magnetron DC sputtering system
  • Degassing device in magnetron DC sputtering system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015] Such as figure 1 and figure 2 The shown degassing device in a magnetron DC sputtering system includes a degassing chamber 1 and a transmission track extending to the inside of the degassing chamber 1; the inside of the degassing chamber 1 is provided with an electric heat source 5. In the degassing chamber 1, the transmission track is composed of two transmission chains 2 parallel to each other, and a plurality of transmission holes 3 are respectively arranged in the two transmission chains 2, and the transmission in the two transmission chains 2 The holes 3 are opposite to each other; each transmission hole 3 is provided with a transmission link 4, and the transmission link 4 adopts an "L"-shaped structure, which includes a first rod extending in the horizontal direction and connected to the transmission hole 3 segment 41, and a second rod segment 42 extending in the vertical direction, the end of the second rod segment 42 is provided with a placement tray 43 for pla...

Embodiment 2

[0020] As an improvement of the present invention, the upper end surface of each placement tray 43 is provided with a rubber anti-skid layer 44, which includes a plurality of anti-skid lines, which can significantly increase the friction between the material and the placement tray through the rubber anti-skid layer, thereby The probability of material falling is significantly improved.

[0021] The remaining features and advantages of this embodiment are the same as those of Embodiment 1.

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Abstract

The invention discloses a degassing device in a magnetic control direct current sputtering system. The degassing device in the magnetic control direct current sputtering system comprises a degassing cavity and transmission tracks extending into the degassing cavity; the transmission tracks are composed of two parallel transmission chains in the degassing cavity; multiple transmission holes are formed in the two transmission chains respectively and are in one-to-one correspondence; a transmission connecting rod is disposed in each transmission hole and is of an L-shaped structure, and containing plates for containing materials are disposed at the ends of the transmission connecting rods; the containing plates extend in the horizontal direction. By means of the degassing device in the magnetic control direct current sputtering system in the technical scheme, the upper end faces and the lower end faces of the materials can make contact with air, so that the wet gas removing effect on the materials by the degassing cavity is remarkably improved.

Description

technical field [0001] The invention relates to a semiconductor processing device, in particular to a degassing device in a magnetron direct current sputtering system. Background technique [0002] In magnetron DC sputtering, the material needs to be degassed before processing, that is, the moisture in the material during transportation and storage is removed by heating. Existing degassing devices often bring materials into the degassing chamber through a conveyor belt for heat treatment. However, since the lower end surface of the material is always in contact with the conveyor belt during the conveying process, it is difficult to guarantee the degassing effect. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a degassing device in a magnetron DC sputtering system, which can significantly improve the moisture removal effect of materials. [0004] In order to solve the above technical problems, the present inven...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/35
Inventor 史进伍志军
Owner SUZHOU SAISEN ELECTRONICS TECH