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Suspension board with circuit

A suspension board and circuit technology, applied in the directions of printed circuits, printed circuits, printed circuits connected with non-printed electrical components, etc., can solve problems such as insufficient satisfaction, and achieve the effect of preventing deformation

Inactive Publication Date: 2016-02-24
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, even in the suspension board proposed in Japanese Patent Application Laid-Open No. 10-27447, there are cases where the above-mentioned requirements cannot be sufficiently satisfied.

Method used

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  • Suspension board with circuit

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0158] Prepare a sheet metal support layer made of stainless steel with a thickness of 18 μm (refer to Figure 5 (a) and Image 6 ).

[0159] Next, an insulating base layer made of polyamide with a thickness (TI1) of 10 μm is formed on the upper side of the metal support layer (see Figure 5 of (b), Figure 7 (a) and Figure 7 (b)).

[0160] Specifically, based on the compounding recipe in Table 1, first, a photosensitive polyamic acid resin solution was prepared. Next, the prepared photosensitive polyamic acid resin solution was applied on the entire upper surface of the metal supporting layer, and dried to form a base protection film. Next, the base protective film is exposed in the above-mentioned pattern, then developed, and then heated and cured. In addition, the hygroscopic expansion coefficient of the insulating base layer was 13 ppm, and the thermal expansion coefficient was 18 ppm.

[0161] Table 1

[0162]

[0163] Next, the second opening and the slit a...

Embodiment 2

[0176] In the process of forming the conductor layer, the first wiring and the second wiring are formed so as to deviate from each other in the width direction when projected in the thickness direction and to be symmetrical about the passing axis (PA). Example 1 was processed in the same manner, and a suspension board with a circuit was fabricated (refer to Figure 10 ).

[0177] In addition, the shift width (G) of the first wiring and the second wiring was 10 μm.

Embodiment 3

[0179] Except for forming the conductive layer from the second conductive layer, and forming the insulating layer from the base insulating layer and the second cover insulating layer, the same process as in Example 1 was carried out to produce a suspension board with circuit (refer to Figure 12 and Figure 13 ).

[0180] In addition, the thickness (TI2) of the second insulating cover layer on the second wiring was 5 μm, which was the same as the thickness (TI1) of the insulating base layer.

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Abstract

A suspension board with circuit includes a gimbal portion. The gimbal portion includes a tongue portion formed at the inner side of the opening for being mounted with a slider mounted with a magnetic head for being electrically connected to the conductive layer, an outrigger portion formed at the outer side of the opening to support the tongue portion, and a passing portion passing through the opening of the gimbal portion and / or an outer side region of the outrigger portion. The passing portion includes the conductive layer and the insulating layer covering the conductive layer. The thickness of a lower half portion of the insulating layer in the passing portion is the same as that of an upper half portion thereof.

Description

[0001] This application is a divisional application of an application with a filing date of December 29, 2011, an application number of 201110460949.6, and an invention title of "suspension board with circuit and its manufacturing method". technical field [0002] The present invention relates to a suspension board with a circuit and a manufacturing method thereof. Specifically, the present invention relates to a suspension board with a circuit mounted on a hard disk drive and a manufacturing method thereof. Background technique [0003] The suspension board with the circuit installed on the hard disk drive is equipped with a slider for mounting the magnetic head, and the slider is floated at a small interval relative to the hard disk drive. [0004] It is required to stably maintain the slider with a constant upward attitude (attitude angle) relative to the hard disk drive without being affected by moisture, heat, etc. contained in the air. [0005] In order to meet the abo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G11B5/48H05K1/18
CPCG11B5/484G11B5/4853G11B5/486H05K1/056H05K1/189H05K2201/0191H05K2201/09081Y10T29/49126
Inventor 水谷昌纪
Owner NITTO DENKO CORP