Alignment detection method for multi-layer circuit board

Abstract

The invention relates to a multilayer circuit board alignment degree detection method, which is used for detecting the alignment degree of a multilayer circuit board. The multilayer circuit board comprises a plurality of circuit boards which are arranged in a stacked mode. The multilayer circuit board alignment degree detection method comprises the steps of setting one of the plurality of circuit boards to be a reference board, wherein the reference board is provided with a first detection pattern, and setting another one of the plurality of circuit boards to be a detection board, wherein the detection board is provided with a second detection pattern; and detecting an offset of the second detection pattern on the detection board relative to the first detection pattern on the reference board by using X-rays so as to acquire the interlayer alignment degree. According to the multilayer circuit board alignment degree detection method, the offset of the first detection pattern relative to the second detection pattern can be acquired through directly detecting the partially overlapped first detection pattern and the second detection pattern which are correspondingly arranged on the reference board and the detection board in a stacked mode through the X-rays, so that the interlayer alignment degree is acquired, and operations such as slicing are not required to be carried out on the multilayer circuit board, thereby shortening the detection time, and having high detection efficiency.

Description

technical field [0001] The invention relates to the field of detection of interlayer alignment of printed circuit boards, in particular to a method for detection of alignment of multilayer circuit boards. Background technique [0002] With the development of society and the advancement of technology, the packaging density of integrated circuits has gradually increased, resulting in a high concentration of interconnection lines, which has led to the increasing use of multilayer circuit boards. At present, Mass Lam (pinless positioning lamination process) is usually used to make multi-layer boards with n layers from L1 to Ln. The method is as follows: first make L2 / L3, L4 / L5,...Ln-2 / Ln-1 multiple For each inner layer core board, multiple inner layer core boards are fused and fixed with corresponding specifications and quantities of prepregs, and then a MassLam press is used to apply a certain temperature and pressure to cure the multilayer board. The multi-layer board produce...

AI Technical Summary

Problems solved by technology

[0004] Based on this, it is necessary to provide a multilayer circuit board alignment detection method that can easily detect the interlayer alignment for the problem that the interlayer alignment detection of multilayer circuit boards is difficult

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