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A kind of oled display panel and packaging method thereof, display device

A display panel and encapsulation adhesive technology, which is applied to semiconductor devices, electrical components, circuits, etc., can solve the problem that fillers and cofferdams cannot achieve sufficient and defect-free contact, and achieve the effect of improving the impact of encapsulation performance

Active Publication Date: 2017-11-24
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the defects of the prior art, the present invention provides an OLED display panel, its packaging method, and a display device, which can solve the problem in the prior art that the Filler and the cofferdam dam cannot achieve sufficient and defect-free contact, and improve the corner air bubbles. and other adverse factors affect the performance of display panel packaging

Method used

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  • A kind of oled display panel and packaging method thereof, display device
  • A kind of oled display panel and packaging method thereof, display device
  • A kind of oled display panel and packaging method thereof, display device

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Embodiment Construction

[0042] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0043] image 3 It is a schematic structural diagram of an OLED display panel provided by an embodiment of the present invention. Such as image 3 As shown, the OLED display panel includes: a first substrate 1 and a second substrate 5 facing each other, a first encapsulant 2 , a second encapsulant 3 and a plurality of retaining walls 4 .

[0044] Among them, such as image 3 As shown, the first encapsulant 2 is located between the first substrate 1 and the ...

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Abstract

An embodiment of the present invention provides an OLED display panel, a packaging method thereof, and a display device, including a first substrate and a second substrate facing each other, a first encapsulant, a second encapsulant, and a plurality of retaining walls; the first An encapsulant is located between the first substrate and the second substrate, and forms a sealed space with the first substrate and the second substrate; the second encapsulant is filled in the first substrate, the second substrate In the sealed space formed by the second substrate and the first encapsulant; the retaining wall is arranged in the sealed space formed by the first substrate, the second substrate and the first encapsulant, and a plurality of the The retaining walls are arranged at intervals along the first encapsulant. The embodiments of the present invention can solve the problem in the prior art that the Filler and the cofferdam dam cannot achieve sufficient and defect-free contact during OLED display panel packaging, and improve the impact of adverse factors such as corner bubbles on the packaging performance of the display panel.

Description

technical field [0001] Embodiments of the present invention relate to the field of display technology, and in particular to an OLED display panel, a packaging method thereof, and a display device. Background technique [0002] Organic Light-Emitting Diode (OLED) devices have become extremely competitive and promising due to their advantages such as all-solid-state structure, high brightness, full viewing angle, fast response speed, and flexible display. next-generation display technology. Since organic light-emitting materials are extremely sensitive to components such as water and oxygen, in order to meet the normal lifespan of OLEDs, the packaging must achieve a barrier performance of 10E-6g / (m3day). This poses a great challenge to the development of packaging materials and processes. [0003] At present, glass (frit) packaging in small and medium sizes can meet the needs of high-efficiency and high-performance packaging, but it cannot be extended and applied in the fiel...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/52H01L27/32
CPCH10K59/00H10K50/8426H10K50/84H10K59/122H10K50/8428H10K50/844H10K71/00
Inventor 宋文峰
Owner BOE TECH GRP CO LTD