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Integrated power assembly with stacked individually packaged power devices

A technology of integrated power and components, applied in the direction of output power conversion devices, semiconductor/solid-state device components, semiconductor devices, etc., can solve the problem of increasing resistance

Inactive Publication Date: 2016-06-22
INFINEON TECH AMERICAS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, routing between semiconductor die through conductive clips and PCB may undesirably increase resistance

Method used

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  • Integrated power assembly with stacked individually packaged power devices
  • Integrated power assembly with stacked individually packaged power devices
  • Integrated power assembly with stacked individually packaged power devices

Examples

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Embodiment Construction

[0017] The following description contains specific information about embodiments of the present disclosure. The drawings in this application and their accompanying detailed description are directed to exemplary embodiments only. Unless otherwise stated, identical or corresponding elements in the figures may be indicated by identical or corresponding reference numerals. Furthermore, the drawings and illustrations in the present application are generally not to scale and are not intended to correspond to actual relative dimensions.

[0018] now refer to Figure 1A , Figure 1A A circuit diagram of an exemplary power conversion circuit according to an embodiment of the application is illustrated. as in Figure 1A As shown in , a power conversion circuit 100 includes a driver integrated circuit (IC) 110 and a power switching stage 102 having a high-side switch 120 and a low-side switch 130 . The driver IC 110 is configured to provide the high-side drive signal HO and the low-...

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Abstract

The disclosure relates to an integrated power assembly with stacked individually packaged power devices. The integrated power assembly is disclosed. The integrated power assembly includes a first leadframe having partially etched segments, a first semiconductor die configured for attachment to a partially etched segment of the first leadframe, and a second leadframe having a legless conductive clip coupled to a top surface of the first semiconductor die. The integrated power assembly also includes a third leadframe over the second leadframe and having a partially etched segment, a second semiconductor die configured for attachment to the partially etched segment of the third leadframe, wherein the second semiconductor die is coupled to the first semiconductor die through the partially etched segment of the third leadframe, and wherein the partially etched segment of the third leadframe is situated on the legless conductive clip of the second leadframe.

Description

[0001] Cross References to Related Applications [0002] This application claims the benefit and priority of Provisional Patent Application Serial No. 62 / 090501, entitled "Package on Package with Dual Gauge," filed December 11, 2014. The content disclosed in this provisional application is fully incorporated into this application by reference. technical field [0003] The present disclosure relates to integrated power assemblies having stacked individually packaged power devices. Background technique [0004] In order to improve the form factor, electrical and thermal performance, and manufacturing costs of power converters, it is often desirable to integrate components of the power converter circuitry into power semiconductor packages. Today's power conversion system designs require versatility and adaptability in packaging different types of power transistors in various configurations such as half-bridge or cascode switches. [0005] In conventional power semiconductor ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/31H01L23/488H01L23/495H02M1/00
CPCH01L23/31H01L23/488H01L23/49575H01L25/07H01L23/3107H01L23/49524H01L23/49562H01L2224/37599H01L2224/371H01L2224/8484H01L2224/84801H01L2224/37124H01L2224/37147H01L2224/83801H01L2224/8384H01L2224/37184H01L23/49537H01L2924/13091H01L2924/13055H01L24/37H01L2924/00014H01L2924/00H01L24/34
Inventor 曹应山
Owner INFINEON TECH AMERICAS CORP