Chip having information of result of chip probing test information and method for checking result of chip probing test
A technology of chip testing and result information, which is applied in the direction of semiconductor/solid-state device testing/measurement, measuring electronics, and measuring devices. Features and Benefits Clear and understandable effects
Active Publication Date: 2016-06-29
NAN YA TECH
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Problems solved by technology
However, when an error occurs in a packaged chip, it is difficult to efficiently check whether the chip in the package has passed the previous chip test (chip probing test)
The traditional method is to read chip information such as wafer lot number (lotnumber), wafer engraving number (wafernumber) and chip coordinates, etc. from the chip serial number (chipID), and contact the chip manufacturer to request the corresponding test record file , the exchange process is very complicated and inconvenient for packaging and testing manufacturers
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[0028] The following is a detailed description of the examples in conjunction with the accompanying drawings to better understand the implementation of the present invention, but the examples provided are not intended to limit the scope of the present invention, and the description of the structure and operation is not intended to The execution sequence is limited, and any device with equivalent functions produced by recombining components is within the scope of the present invention. In addition, according to industry standards and common practice, the drawings are only for the purpose of assisting explanation, and are not drawn according to original scale. In fact, the dimensions of various features can be arbitrarily increased or decreased for the convenience of illustration. In the following description, the same components will be described with the same symbols for easy understanding.
[0029] Unless otherwise specified, the terms used throughout the specification and cl...
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A chip having information of a result of a chip probing test and a method for checking the result of the chip probing test are disclosed. The chip includes a chip substrate and a record module located on the chip substrate. The record module is configured to record a status code indicating whether the chip passes the chip probing test. The method includes following steps: executing the chip probing test for the chip; and recording the status code in the record module of the chip, the status code indicating whether the chip passes the chip probing test. By recording information of the result in the chip probing test in the chip on the record module, the user can easily check whether the chip passes the chip probing test without the need to contact the chip manufacturer for a corresponding test record file.
Description
technical field [0001] The present invention relates to semiconductor manufacturing process, and in particular to chip testing in semiconductor manufacturing process. Background technique [0002] In recent years, a multi-chip package (Multi-Chip-Package, MCP) technology has been widely used to package multiple memory chips together to increase the memory capacity. However, when an error occurs in the packaged chip, it is difficult to efficiently check whether the packaged chip has passed the previous chip probing test. The traditional method is to read chip information such as wafer lot number (lotnumber), wafer engraving number (wafernumber) and chip coordinates, etc. from the chip serial number (chipID), and contact the chip manufacturer to request the corresponding test record file , The exchange process is very complicated and inconvenient for packaging and testing manufacturers. Contents of the invention [0003] One aspect of the present invention relates to a chi...
Claims
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IPC IPC(8): H01L21/66
CPCG01R31/31935G01R31/31718G11C29/006G11C2029/5602
Inventor 李文明
Owner NAN YA TECH