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A fully automatic ball planting machine and ball planting method thereof

A fully automatic and ball-planting technology, which is applied in the manufacture of electrical components, electrical solid devices, semiconductor/solid devices, etc., can solve the problems of high price, complex action mechanism, and high hardware quality requirements, and achieve simple production, flexible operation, The effect of high ball planting efficiency

Active Publication Date: 2018-06-29
SHANGHAI WEISONG IND AUTOMATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The action mechanism of this method is complex, requiring image recognition system, precise positioning system, high-performance detection system, etc., the hardware quality requirements are high, and the price is extremely expensive

Method used

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  • A fully automatic ball planting machine and ball planting method thereof
  • A fully automatic ball planting machine and ball planting method thereof
  • A fully automatic ball planting machine and ball planting method thereof

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Embodiment

[0046] A fully automatic ball planting machine, such as figure 1 , figure 2As shown, it includes a stand 7, a mesh plate 9, a ball feeding mechanism, a six-degree-of-freedom manipulator 1, a scraper 6 and a three-dimensional force sensor 5, the middle part of the stand 7 runs through up and down, and the mesh plate 9 is horizontally arranged in the middle of the stand 7. The stencil 9 is fixed on the platform 7 through the stencil clamping mechanism. The middle part of the stencil 9 is the wafer position 8, and the wafer 20 is placed under the wafer position 8. The stencil 9 is provided with a The mesh holes corresponding to the circle 20PAD points are used for the leakage of solder balls 19; the mesh plate clamping mechanism is four mesh plates clamping cylinders 10 arranged at the four corners of the stand 7, and the mesh plate 9 is composed of four mesh plates The clamping cylinder 10 is clamped in a horizontal state. The ball supply mechanism is arranged on the platform...

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Abstract

The present invention relates to an automatic ball mounter and ball mounting method. The automatic ball mounter comprises a stand, a screen, a ball supply mechanism, a manipulator with six degrees of freedom, a scraper plate and a three-dimensional force sensor. The screen plate is fixed on the stand through a screen clamping mechanism, meshes corresponding to a wafer PAD point are arranged on the screen, and the ball supply mechanism is configured to supply tin balls to the screen; the manipulator with six degrees of freedom is a driving mechanism configured to drive the motion of the scraper plate and is configured to simulate the manual ball mounting mode, and the scraper plate is arranged at the end of the manipulator with six degrees of freedom and performs ball mounting motion driven by the manipulator with six degrees of freedom; and the three-dimensional force sensor is arranged between the end of the manipulator with six degrees of freedom and the scraper plate and is configured to detect the abrupt change of bearing of the scrape plate in the process of ball mounting and transmit the bearing information of the scrape plate to the manipulator with six degrees of freedom. Compared with the prior art, the automatic ball mounter employs a manipulator with six degrees of freedom to simulate the manual ball mounting motion and allows the ball mounting motion to be more flexible and stable. Besides, the stable ball mounting quality is able to obtain guarantee in the condition of mass production in a factory.

Description

technical field [0001] The invention relates to a ball planting device, in particular to an automatic ball planting machine and a ball planting method thereof. Background technique [0002] Wafer-level ball planting machine is a high-end semiconductor packaging equipment, which is used to accurately place solder balls on the wafer that has been printed with flux. At present, the diameter of solder balls used in wafer-level ball planting machines is generally in the range of 75 μm to 300 μm One of its core technologies is the ball planting method. [0003] In order to accurately implant solder balls into the wafer, the existing wafer-level ball placement equipment basically adopts manual ball placement, ball sweeping ball placement, jig suction ball placement, and other methods. [0004] Manual ball planting (such as patent CN103606527A) is that the operator holds a plastic scraper to scrape the ball back and forth on the screen several times, and scrapes the ball into the m...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67H01L21/60
CPCH01L21/67011H01L24/11
Inventor 刘劲松郭俭张应伍谢旭波林金木
Owner SHANGHAI WEISONG IND AUTOMATION
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