Method for producing substrates for superconducting layers

A superconducting and substrate technology, used in the manufacture of stretchable conductors/cables, for forming corrugations on conductors/cables, superconducting devices, etc. Loss and other issues, to minimize material costs and achieve the effect of large-scale manufacturing

Inactive Publication Date: 2016-07-20
DANMARKS TEKNISKE UNIV
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  • Abstract
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  • Claims
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Problems solved by technology

However, while it has excellent shape when carrying DC, it can exhibit high losses when used in alternating current (AC) applications
[0003] Currently available means of reducing AC losses may not be suitable for direct processing of very long lengths of superconducting tape

Method used

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  • Method for producing substrates for superconducting layers
  • Method for producing substrates for superconducting layers
  • Method for producing substrates for superconducting layers

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Experimental program
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Embodiment Construction

[0136] figure 1 A typical superconductor structure is shown, which is a sandwich structure comprising a substrate 102 , a buffer layer 104 and a superconducting material 106 . In this figure, it is assumed that the current flows through the superconducting material 106 in the z-direction.

[0137] When the superconducting material is a relatively wide (where width is measured in the x-direction) layer of material, such as when formed as a layer on a broad planar substrate, the superconducting layer exhibits relatively large AC losses, which can The reduction is achieved by converting a single wide superconducting layer into a plurality of relatively narrower lines (ie, lines having a cross section in the yx plane with a smaller width measured in the x direction compared to the original wide layer).

[0138] figure 2 is a top view of a superconducting material, where the left side (a) illustrates a non-striped superconductor 208 formed on a planar layer, and the right side ...

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Abstract

There is provided a method for producing a substrate suitable for supporting an elongated superconducting element, wherein one or more elongated strips of masking material are placed on a solid element (202) so as to form one or more exposed elongated areas being delimited on one or two sides by the elongated strip(s) of masking material, and placing filling material on the solid element so that each exposed elongated area within the one or more exposed elongated areas is covered by a portion of filling material (318a-318c) where each portion of filling material also covers at least a portion of the adjacent elongated strip of masking material and subsequently removing the one or more elongated strips of masking material so as to form one or more corresponding undercut volumes, where each undercut volume within the one or more undercut volumes is formed along a portion of filling material and between the portion of filling material and the solid element. The method may further comprise placing buffer material (640) and or superconducting material (642, 644, 646)) on the substrate, so as to provide a superconducting structure (601) with reduced AC losses.

Description

technical field [0001] The invention relates to a method for manufacturing a substrate, and in particular to a substrate suitable for supporting elongate superconducting elements and to a corresponding method for producing and using such a substrate. Background technique [0002] A superconducting structure may be considered beneficial as it enables the conduction of electrical current without resistive losses. Superconducting structures such as superconducting tapes are therefore used in many applications, such as generators and transformers. However, while it possesses excellent shape when carrying direct current, it can exhibit high losses when used in alternating current (AC) applications. [0003] Currently available means of reducing AC losses may not be suitable for direct processing of very long lengths of superconducting tape. [0004] In patent application US Pat. No. 7,593,758 B2, a strip with segmented high-temperature superconductor layers is proposed. A frac...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L39/24
CPCC25F3/02C25D5/627C25D5/12C25D5/611C25D5/14H10N60/203H10N60/0576H10N60/0801H10N60/81H10N60/857C25D3/12C25D3/38C25D5/022C25D5/40C25D5/48H01B12/06H01B12/10H01B13/0009H01B13/008
Inventor A·C·伍尔夫
Owner DANMARKS TEKNISKE UNIV
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