Methods used for failure analysis

Abstract

The invention provides a method for failure analysis, comprising the following steps: introducing failure to a specific position of a chip; testing out the electrical address of the failure position; and determining the conversion relationship between an electrical failure address and a physical failure address based on the specific position and the electrical address. Through the method for failure analysis provided by the invention, the corresponding relationship between an electrical failure address and a physical failure address can be identified effectively, and therefore, the address of an actually failing physical unit of a chip can be calculated out precisely based on an electrical failure address obtained from test, and a good basis is provided for physical failure analysis of next phase.

Description

technical field [0001] The present invention relates to the technical field of semiconductors, in particular to a method for failure analysis (Failure Analysis, FA). Background technique [0002] Generally speaking, the failure of integrated circuits is inevitable in the process of development, production and use. With the continuous improvement of people's requirements for product quality and reliability, failure analysis is becoming more and more important. Chip failure analysis can help IC designers and factory process technicians find design defects, mismatch of process parameters, or improper design and operation. [0003] In the existing failure analysis method, the electrical address of the failure location is usually obtained by testing first, and then the adjacent area of ​​the failure address is directly checked on the chip to find the actual physical failure location where the abnormality occurs. However, this method is inefficient and imprecise. In addition, s...

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Problems solved by technology

However, this method is inefficient and imprecise

In addition, some physical structures cannot be reflected in the electrical address, making it difficult to find the physical failure address through the failure electrical address

For example, the physical structure of the image sensor contains some rows and columns, which will not output images when they are converted into the electrical structure, so the number of rows and columns of the final electrical address will be less than the physical rows and columns; and because it is impossible to know which physical rows and columns do not output images, Therefore, the greater the difference between the number of electrical rows and columns and the number of physical rows and columns, the more difficult it is to accurately find the actual failure location using the existing direct inspection method

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