Unlock instant, AI-driven research and patent intelligence for your innovation.

Fingerprint sensor and electronic device

A fingerprint sensor and sensor array technology, applied in the acquisition/organization of fingerprints/palmprints, instruments, circuits, etc., can solve the problems of large-scale application and high cost of unfavorable fingerprint sensors

Active Publication Date: 2019-09-27
柳州梓博科技有限公司
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the current high cost of fingerprint sensors based on silicon technology is not conducive to the large-scale application of fingerprint sensors

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Fingerprint sensor and electronic device
  • Fingerprint sensor and electronic device
  • Fingerprint sensor and electronic device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0049] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0050]In the description of the present invention, it should be understood that the terms "first" and "second" are used for description purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly indicating the quantity of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of said features. In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined.

[0051] In the descri...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a fingerprint sensor and an electronic device. The fingerprint sensor includes a substrate, a sensor array and a control chip. The sensor array and the control chip are arranged on the substrate at intervals. Connect the sensor array. In the above-mentioned fingerprint sensor, since the sensor array and the control chip are arranged on the substrate at intervals and connected by connecting wires, different methods can be used to manufacture the sensor array and the control chip, which can significantly reduce the cost of the fingerprint sensor and facilitate the development of the fingerprint sensor. large-scale application.

Description

technical field [0001] The invention relates to the field of fingerprint identification, and more specifically, to a fingerprint sensor and an electronic device. Background technique [0002] With the popularity of fingerprint sensors in smart mobile terminals, the demand for fingerprint sensors is increasing. Fingerprint sensors have special requirements on the sensing area. Theoretically, the larger the sensing area, the better the recognition rate. However, the paradox is that the larger the sensing area, the higher the cost of the fingerprint sensor. [0003] In the related art, a fingerprint sensor based on silicon technology includes a sensor array and a control circuit. Taking a sensor array with a resolution of 508dpi and 96*96 as an example, the required physical area of ​​a silicon wafer is 23 square millimeters. Such a physical area occupies to more than 70% of the entire fingerprint sensor. [0004] However, the cost of the current fingerprint sensor based on t...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G06K9/00
CPCG06V40/1306H01L2224/48091H01L2224/49175H01L2924/00014
Inventor 田浦延
Owner 柳州梓博科技有限公司