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Cover plate, preparation method of cover plate and display device

A cover plate and display panel technology, which is applied in optics, instruments, electrical digital data processing, etc., can solve the problems of multiple patterning processes, increased production costs, and affecting product performance, so as to improve performance, increase transmittance, The effect of high yield

Inactive Publication Date: 2017-01-04
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This leads to the need for at least three patterning processes in the process of forming the first touch electrode 10 and the second touch electrode 20, thus making the number of patterning processes more, resulting in increased production costs
[0005] In addition, using the bridge 30 to connect the second touch sub-electrode 201 is prone to the possibility of breakdown at the bridge point during the Electro-Static Discharge (ESD) process, which affects product performance.

Method used

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  • Cover plate, preparation method of cover plate and display device
  • Cover plate, preparation method of cover plate and display device
  • Cover plate, preparation method of cover plate and display device

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preparation example Construction

[0065] The embodiment of the present invention also provides a method for preparing a cover plate, as shown in FIG. 8(a), including the following steps:

[0066] S10 , forming a first electrode layer on the transparent substrate 41 through a patterning process; the first electrode layer includes a plurality of first electrodes, and the first electrodes have a grid structure.

[0067] Among them, refer to Figure 2-Figure 4 As shown, the first electrode may be, for example, the sensing electrode 42 , and in this case the first electrode layer is the sensing electrode layer.

[0068] Here, the patterning process is not limited to patterning using a mask, and may also include other patterning methods such as printing and printing. That is, in the embodiments of the present invention, any process that can form the first electrode layer can be called a patterning process.

[0069] S11. Reference Figure 3-Figure 4 As shown, an insulating layer 44 is formed on the transparent sub...

Embodiment 1

[0078] Embodiment 1: a preparation method of a cover plate, as shown in Figure 8(b), comprises the following steps:

[0079] S101 , forming a first conductive film on the transparent substrate 41 .

[0080] Wherein, the first conductive thin film may be formed by various methods such as deposition, coating, sputtering and the like.

[0081] S102, forming a photoresist on the first conductive film.

[0082] Wherein, the photoresist can be formed by deposition, coating and the like.

[0083] S103 , placing a mask on the photoresist, exposing and developing the photoresist, so that the remaining photoresist corresponds to the first electrode to be formed into the first electrode layer.

[0084] Among them, refer to Figure 2-Figure 4 As shown, the first electrode may be, for example, the sensing electrode 42 , and in this case the first electrode layer is the sensing electrode layer.

[0085] S104. Etching the first conductive film not covered by the photoresist to form the f...

Embodiment 2

[0097] Embodiment 2, a preparation method of a cover plate, as shown in FIG. 8(c), includes the following steps:

[0098]S201 , forming a first electrode layer on the transparent substrate 41 through a printing process or a printing process; the first electrode layer includes a plurality of first electrodes, and the first electrodes are in a grid structure.

[0099] Among them, refer to Figure 2-Figure 4 As shown, the first electrode may be, for example, the sensing electrode 42 , and in this case the first electrode layer is the sensing electrode layer.

[0100] S202. Reference Figure 3-Figure 4 As shown, an insulating film is coated on the transparent substrate formed with the first electrode layer to form the insulating layer 44 .

[0101] S203, forming a second electrode layer on the insulating layer 44 through a printing process or a printing process; the second electrode layer includes a plurality of second electrodes, the second electrodes are in a grid structure, t...

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Abstract

The embodiment of the invention provides a cover plate, a preparation method of the cover plate and a display device thereof and relates to the technical field of touch control. The use frequency of composition process can be reduced and the bridge point breakdown phenomenon in ESD process can be avoided. The cover plate comprises a transparent substrate, an induction electrode layer and a driving electrode layer which are arranged on the transparent substrate, wherein the induction electrode layer and the driving electrode layer are isolated by an insulating layer; the induction electrode layer comprises a plurality of induction electrodes; the driving electrode layer comprises a plurality of driving electrodes; the induction electrodes and the driving electrodes are arranged in a crossing form; the induction electrodes and the driving electrodes have grid structures. The cover plate is applied to a touch display device.

Description

technical field [0001] The invention relates to the field of touch technology, in particular to a cover plate, a preparation method thereof, and a display device. Background technique [0002] With the rapid development of display technology, touch screens have been widely used in electronic products such as smart phones, tablet computers, and televisions. Since the capacitive touch screen has the characteristics of accurate and sensitive positioning, good touch feeling and long service life, it has attracted more and more attention. Touch screens can be divided into mutual capacitive touch screens and self-capacitive touch screens according to the touch method. Because mutual capacitive touch screens can realize multi-touch, they have become the mainstream and future of the touch screen market. development trend. [0003] Among them, the One Glass Solution (OGS for short) refers to the bridge between the touch electrode made of Indium tin oxide (ITO) material and the ITO ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F3/041G06F3/044
CPCG06F3/041G06F3/044G06F2203/04103G06F3/0445G06F3/0446G06F2203/04111G06F2203/04112G02F2201/121G06F3/047G06F2203/04104
Inventor 刘国冬胡明张明许军
Owner BOE TECH GRP CO LTD
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