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Semiconductor Device And Manufacutring Method Thereof

A semiconductor and device technology, applied in the field of semiconductor devices and their manufacturing, can solve the problems of scaling down, increasing the complexity of processing and manufacturing ICs, etc.

Active Publication Date: 2017-01-04
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Such scaling down also increases the complexity of handling and manufacturing ICs

Method used

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  • Semiconductor Device And Manufacutring Method Thereof
  • Semiconductor Device And Manufacutring Method Thereof
  • Semiconductor Device And Manufacutring Method Thereof

Examples

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Embodiment Construction

[0009] The following disclosure provides many different embodiments or examples for implementing different features of the presented subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. Of course, these are examples only and are not intended to limit the invention. For example, in the following description, forming a first component over or on a second component may include embodiments in which the first component and the second component are formed in direct contact, and may also include embodiments in which the first component and the second component may be formed in direct contact. An embodiment in which an additional part is formed so that the first part and the second part may not be in direct contact. In addition, the present invention may repeat reference numerals and / or letters in various instances. This repetition is for the sake of simplicity and clarity and does not in itself indicate a relations...

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Abstract

A semiconductor device includes a substrate, at least one layer, a metal adhesive, and a metal structure. The layer is disposed on the substrate. The layer has an opening, and the opening has a bottom surface and at least one sidewall. The metal adhesive is disposed on the bottom surface of the opening while leaving at least a portion of the sidewall of the opening exposed. The metal structure is disposed in the opening and on the metal adhesive. The embodiment of the present invention also relates to a manufacturing method of the semiconductor device.

Description

technical field [0001] Embodiments of the present invention relate to integrated circuit devices, and more particularly, to semiconductor devices and methods of manufacturing the same. Background technique [0002] The continual effort to improve the performance of semiconductor devices has brought about a continual effort to scale down the dimensions of device features, thereby increasing the speed of device performance and its functional performance. During the evolution of semiconductor integrated circuits (ICs), functional density (i.e., the number of interconnected devices per chip area) has generally increased, while geometry size (i.e., the smallest component (or line) that can be produced using a fabrication process) decrease. Such scaling down also increases the complexity of handling and manufacturing the IC. Contents of the invention [0003] An embodiment of the present invention provides a semiconductor device, comprising: a substrate; at least one layer dis...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L29/78H01L21/336H01L29/423H01L21/28H01L21/768
CPCH01L21/28H01L21/768H01L21/76829H01L21/76832H01L29/4232H01L29/4236H01L29/66477H01L29/78H01L29/66545H01L21/28088H01L29/4966H01L29/513H01L29/517H01L21/76843H01L21/76879H01L21/28568
Inventor 林加明张简旭珂林俊泽
Owner TAIWAN SEMICON MFG CO LTD