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Bonding device manufacturing apparatus and bonding device manufacturing method

A technology for laminating equipment and manufacturing equipment, which can be used in lamination equipment, identification equipment, chemical instruments and methods, etc., and can solve problems such as difficulty in precision

Active Publication Date: 2017-01-11
SHIN ETSU ENG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0013] Therefore, if a local stress remains at the central position of the glass substrate, there will be very little positional deviation at the end positions where the marks are aligned using the camera, but at the central position of the glass substrate, the distance between the substrates will be greater than that at the end positions. The relative positional deviation becomes large, and it is very difficult to control the alignment error of the glass substrate for G8 size liquid crystal to sub-micron accuracy

Method used

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  • Bonding device manufacturing apparatus and bonding device manufacturing method
  • Bonding device manufacturing apparatus and bonding device manufacturing method
  • Bonding device manufacturing apparatus and bonding device manufacturing method

Examples

Experimental program
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Embodiment 1

[0121] Next, various embodiments of the present invention will be described with reference to the drawings.

[0122] Such as figure 1 (a), figure 1 (b)~ Figure 4 (a), Figure 4 As shown in (b), in the manufacturing apparatus A of the laminating equipment W according to Embodiment 1 of the present invention, the carrying-in part 4 adopts the above-mentioned floating conveyance method in which the workpiece is floated and conveyed, and is provided with a positioning device for positioning the workpiece. Guides, instead of the aforementioned robot-based transfer method based on transfer robots.

[0123] In detail, the carrying-in unit 4 has a conveyance guide 44 that contacts the upper workpiece W1 and the lower workpiece W2 during workpiece conveyance by the floating conveyance unit 43, and moves along the workpiece conveyance direction (X) by the floating conveyance unit 43. direction) to intersect the direction (Y direction) to limit.

[0124] Preferably, a plurality of ...

Embodiment 2

[0145] Such as Figure 5 (a), Figure 5 (b)~ Figure 7 (a), Figure 7 As shown in (b), in the manufacturing apparatus A of the bonding equipment W according to the second embodiment of the present invention, as the transfer mechanism 12 of the upper holding member 1, the upper holding member 1 or the lower holding member 2 Either or both of the relative approaching movement, the structure of handing over the upper workpiece W1 to the upper chuck surface 11 and the Figure 1 to Figure 4 Example 1 shown is different. In addition to the structure and Figure 1 to Figure 4 Example 1 shown is the same.

[0146] In detail, in Embodiment 2, as the transfer mechanism 12 of the upper side holding member 1, instead of Figure 1 ~ Figure 3 The lift pin 12b shown, as Figure 5 (b) and Figure 6 As shown in (a), the upper holding member 1 and the lower holding member 2 are moved relatively close to each other by the lifting drive unit 3, and the floating portion 22 passing the lowe...

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PUM

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Abstract

A bonding device manufacturing apparatus and a bonding device manufacturing method are provided; the apparatus for manufacturing a bonding device which removes partial strain remaining on a lower workpiece and vacuum-bonds it to an upper workpiece in a smooth state. The upper holding member has a holding portion in which the upper workpiece remains unmovable; the lower holding member includes a floating portion provided with a mechanism for generating a separation pressure and a proximal pressure in a reverse direction from the lower workpiece, and a contact holding portion provided with a mechanism for adjusting the separation pressure and the proximity pressure. The control portion maintains the balance of the separation pressure and the proximity pressure of the floating portion with respect to the lower side holding member, and the lower work piece is supported from the lower side chuck surface in a non-contact manner. The contact portion is switched from the floating portion so that the proximity pressure is gradually increased in the separation pressure, and the lower work piece is brought into contact with the lower side chuck surface. The upper and lower holding members or either of the two holding members are moved closer to each other by the elevating drive section, and the upper workpieces held by the holding portions on the upper chuck surface are overlapped with the lower workpieces.

Description

technical field [0001] The present invention relates to a flat panel display (FPD) or a sensor device such as a liquid crystal display (LCD), an organic EL display (OLED), a plasma display (PDP), a flexible display, or a sensor device such as a touch panel type FPD or Plate workpieces (substrates) such as liquid crystal modules (LCMs) such as 3D (3-dimensional) displays or electronic books, or flexible printed circuit boards (FPCs), bonded to another such as touch panels, cover glass, cover films, or FPDs A manufacturing apparatus of lamination equipment for plate-shaped workpieces (substrates), and a manufacturing method of lamination equipment. Background technique [0002] Conventionally, as a manufacturing apparatus and manufacturing method of such lamination equipment, there is a substrate overlapping device that places the upper substrate and the lower substrate along the through holes provided in the upper substrate holder and the lower substrate holder. The lift pin...

Claims

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Application Information

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IPC IPC(8): B32B37/10B32B37/12
CPCB32B37/10B32B37/1284G02F1/13G09F9/30G09F9/35
Inventor 大谷义和
Owner SHIN ETSU ENG