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Jewelry Gold Plating Device

A technology for jewelry and insulating sleeves, applied in clothing, electrolytic components, jewelry, etc., can solve problems such as manual binding and serious electroplating efficiency, and achieve the effects of improving work efficiency, simple structure and low cost.

Active Publication Date: 2019-02-22
廖彪兴
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention provides a gold-plating device for jewelry to solve the problem in the prior art that when jewelry is gold-plated, manual binding and unbinding are required, resulting in severe electroplating efficiency

Method used

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  • Jewelry Gold Plating Device
  • Jewelry Gold Plating Device
  • Jewelry Gold Plating Device

Examples

Experimental program
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Embodiment Construction

[0023] The embodiments of the present invention will be described in detail below with reference to the accompanying drawings, but the present invention can be implemented in many different ways defined and covered by the claims.

[0024] The present invention provides a jewelry gold plating device, comprising a conductive support 17 and a suspension part 18; the suspension part includes an insulating sleeve 1, a conductive clip 2 and a jewelry hanging fork 3; the conductive clip 2 is fixedly arranged in the insulating sleeve 1, and conducts electricity The clip 2 includes a conductive connecting bar 4 and a clamping portion 5 electrically connected to the conductive connecting bar 4; the jewelry hanging fork 3 includes an insulating fork 6, a conductive pin 7, and a plurality of conductive jewelry hanging pins 8 electrically connected to the conductive pin 7 A part of the conductive needle 7 and a part of the plurality of conductive jewelry hanging needles 8 are located in the...

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PUM

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Abstract

A gold plating device for jewelry comprises a conductive support and suspension parts, wherein each suspension part comprises an insulating bush, a conductive clamp and a jewelry suspension fork, and the conductive clamp is fixed in the insulating bush and comprises a conductive connecting strip and a clamping part electrically connected with the conductive connecting strip; each jewelry suspension fork comprises an insulating fork body, a conductive pin and multiple conductive jewelry suspension pins electrically connected with the conductive pin, a part of the conductive pin and a part of each conductive jewelry suspension pin are located in the insulating fork body, the other part of the conductive pin and the other part of each conductive jewelry suspension pin are exposed outside the insulating fork body; one end of each conductive pin is detachably inserted into the corresponding clamping part from a first end of the corresponding insulating bush, the second end of each insulating bush is detachably connected with a conductive screw on the conductive support, one end of the conductive screw is inserted into the insulating bus and electrically connected with the corresponding conductive connecting strip; the multiple suspension parts are mounted on the conductive support. The fold plating efficiency of the jewelry can be improved by the aid of the gold plating device for the jewelry.

Description

technical field [0001] The invention relates to the field of jewelry manufacturing, in particular to a jewelry gold plating device. Background technique [0002] Figure 5 A schematic structural view of a jewelry gold plating device in the prior art is shown. Such as Figure 5 As shown, the jewelry gold plating device includes a conductive support 17, and the conductive support 17 is a cage-like structure composed of a plurality of conductive strips 16. Please refer to Figure 5 , when connecting the pendant, bind the clip with copper wire 19, and then insert the pendant that needs to be electroformed on the two sharp corners of the copper wire 19. [0003] But, when copper wire 19 is bound on the cage, the place that copper wire 19 contacts with cage has copper wire to come out. Because it is electroforming, only bare contacts can be energized. However, this kind of exposure will absorb gold due to electrification, resulting in a large cost loss. After the electroforming...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D17/06A44C27/00
CPCA44C27/00C25D17/06
Inventor 廖彪兴
Owner 廖彪兴