Mainboard, mobile terminal and mainboard manufacturing method

Abstract

The invention discloses a mainboard, a mobile terminal and a mainboard manufacturing method, and belongs to the technical field of mobile equipment. The method comprises the following steps of: forming a PCB, wherein the PCB includes M jacks used for being inserted by electronic components; establishing a coordinate system Oxy on the installation surface of the PCB; determining position coordinates of N jacks on the coordinate system Oxy, wherein at least two jacks in the N jacks are used for being connected to the same electronic component; determining at least two set insertion pins included by each electronic component, wherein each set insertion pin corresponds to one jack in the N jacks; and, aligning each set insertion pin in the at least two set insertion pins of each electronic component to the corresponding jack, inserting the set insertion pins in the jacks, and thereby, completing installation of the electronic component on the PCB. Alignment of all the electronic components and the jacks on the PCB can be absolutely ensured through the coordinate system Oxy; and thus, the insertion pins of the electronic components can be accurately inserted in the jacks of the PCB.

Description

technical field [0001] The invention relates to the technical field of mobile devices, in particular to a motherboard, a mobile terminal and a method for manufacturing the motherboard. Background technique [0002] With the progress of the times, mobile devices are indispensable communication tools in people's daily work; such as mobile phones and tablet computers, etc., the core electronic components of these mobile devices are installed on the motherboard. [0003] At present, the manufacturing method of the motherboard includes forming a PCB (Printed circuit board, printed circuit) board, aligning all the pins of the electronic components in the jacks on the PCB one by one, pressing the electronic components to insert all the pins of the electronic components on the PCB. On the board, the core electronic components of the mobile device are installed on the motherboard by this method. [0004] In the process of implementing the embodiments of the present invention, the in...

AI Technical Summary

Problems solved by technology

[0005] At present, there is no fixed method to align all the pins of the electronic components with the jacks on the PCB board, which often leads to pressing the electronic components when the pins of the electronic components are not aligned with the jacks on the PCB board, so that the pins of the electronic components cannot be inserted. Connected to the socket of the PCB board, damaging the pins of electronic components

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