System and method for peeling a semiconductor chip from a tape using a multistage ejector

Abstract

A system and method for peeling a semiconductor chip from a tape using a multistage ejector is disclosed. A housing in the multistage ejector houses a plural sets of tape removing contacts. A pick and place unit is moved slowly to have contact with the chip. A vacuum source is utilized for generating vacuum to suck the tape. Plural sets of contacts such as inner, middle and outer contacts are independently or together moved below the tape at various stages by utilizing their respective actuation mechanism. A controller can independently control the movements of each contact to effectively remove or loosen the tape from the chip. A pick and place unit can then pick up the chip easily without any damage to chip.

Description

technical field [0001] The present disclosure generally relates to semiconductor chips. Embodiments of the present disclosure relate to a system and method for stripping semiconductor chips from adhesive tape using a multistage ejector. Background technique [0002] In the fabrication of semiconductor chips, multiple processing steps are performed simultaneously on a single wafer to produce the desired semiconductor integrated circuits (ICs). Typically, ICs are produced in high volume on individual wafers of electronic grade silicon (EGS) or other semiconductor material by processes such as photolithography. The wafer is diced ("diced") into many pieces, each piece containing a copy of the circuit. The process of cutting the wafer is called dicing or singulation, and each piece is called a die or chip. [0003] During the singulation process, it is necessary to protect the chips from damage, since the separation of individual chips from the wafer may cause damage to the c...

AI Technical Summary

Problems solved by technology

Because all the needles move at the same time, a high voltage is created at the center of the chip before it is peeled off, thus increasing the chance of chip damage

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