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Temperature measuring device used for rapid heat treatment equipment

A rapid heat treatment and temperature measurement technology, which is applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as temperature measurement errors, achieve the effects of reducing influence, accurate measurement results, and avoiding differences in emissivity

Active Publication Date: 2017-03-15
48TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP
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  • Application Information

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Problems solved by technology

However, infrared temperature measurement is affected by the emissivity of the measured object. When the emissivity of the measured object is inconsistent with the emissivity of the calibration object, it

Method used

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  • Temperature measuring device used for rapid heat treatment equipment
  • Temperature measuring device used for rapid heat treatment equipment

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[0018] The present invention will be further described in detail below in conjunction with the drawings and specific embodiments of the specification.

[0019] Such as figure 1 with figure 2 As shown, the temperature measurement device for rapid thermal processing equipment of this embodiment includes a temperature measurement infrared probe assembly 1, an emissivity measurement probe 2, a mounting base 3, and a reflector 4. The reflector 4 is located above the mounting base 3. The infrared probe assembly 1 and the emissivity measurement probe 2 are installed on the mounting base 3. The temperature measurement infrared probe assembly 1 passes through the reflector 4, the reflector 4 is provided with a through hole 41, and the emissivity measurement probe 2 is located below the through hole 41. The temperature measurement device for rapid thermal processing equipment uses a temperature measurement infrared probe assembly 1 to measure the temperature of the measured object 6, and u...

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Abstract

The invention discloses a temperature measuring device used for rapid heat treatment equipment. The temperature measuring device comprises a temperature measuring infrared probe assembly, an emissivity measuring probe, a mounting base and a reflector plate, wherein the reflector plate is positioned above the mounting base; the temperature measuring infrared probe assembly and the emissivity measuring probe are arranged on the mounting base; the temperature measuring infrared probe assembly passes through the reflector plate; a through hole is formed in the reflector plate; and the emissivity measuring probe is positioned under the through hole. The temperature measuring device has the advantages that the structure is simple and reliable, the device is not influenced by the emissivity difference of measured objects, and the temperature measurement is accurate.

Description

technical field [0001] The invention relates to rapid heat treatment equipment for semiconductor manufacturing process, in particular to a temperature measuring device for rapid heat treatment equipment. Background technique [0002] Rapid thermal processing (hereinafter referred to as RTP) process is to reduce the thermal budget of the process by shortening the time that the wafer stays in the thermal field by rapidly raising the temperature. RTP technology was originally developed for the annealing process after ion implantation, but due to its very fast heating and cooling The advantages of high speed, shorter process time and smaller cavity volume have been widely used in advanced semiconductor manufacturing processes, and have become the mainstream technology for deep submicron semiconductor wafer heat treatment processes. It is used for ultra-shallow junction advanced The advantages of device and large-size wafer manufacturing process are more obvious. The key applicat...

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Application Information

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IPC IPC(8): H01L21/67
CPCH01L21/67248
Inventor 钟新华袁卫华龙会跃金则军易文杰胡振东
Owner 48TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP