Method for correcting component carrier and automatic assembly machine
A technology for assembling machines and components, applied in the direction of electrical components, electrical components, etc., can solve problems such as reducing the efficiency of manufacturing electronic components, and achieve the effect of high reliability and high precision
Active Publication Date: 2019-05-07
ASM ASSEMBLY SYST GMBH & CO
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
The original assembly of the component carrier can thus be started subsequently, whereby the efficiency of manufacturing electronic assemblies is correspondingly reduced by assembly of the component carrier
Method used
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Embodiment Construction
[0095] Before describing the exemplary embodiments of the present invention with reference to the accompanying drawings, several technical ideas are also described in conjunction with the preferred implementation of the present invention:
[0096] In order to implement the method described above so as to modify the description of the component carrier to be assembled but not yet assembled; according to a preferred embodiment of the present invention, a widget or program for displaying the entire component carrier is provided. The widget has two planes that are shown superimposed: the upper plane contains the housing-like representations assigned to all assembly positions. The lower plane is filled with images taken by the board camera.
[0097] Fill the lower plane without the operator interfering with processing. For this purpose, the surface of the component carrier is subdivided into image segments (“plates”) which are each detected by means of individual image acquisition...
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The invention relates to a method for modifying a description of a component carrier (150) which comprises geometric desired data from electronic components (172, 174, 178, 180). The method comprises (a) detecting, by means of a camera (340), a first image (242) of a first section from a surface of the component support (150); (B) storing the first image (242); (C) displaying the first image (242) for a first time period; (D) determining actual positions of first device pads (292, 294, 296) within the first image (242) associated with a first placement position for a first device (180); (E) comparing the actual positions with desired positions of first component terminal contacts of the first component to be fitted in the first mounting position, which represent a part of the desired geometric data; (F) modifying the description of the component carrier with respect to a desired position of the first component (180), resulting in a modified desired position for which a spatial overlap between the first component terminal contacts (282, 284, 286) Of the first component (180) to be mounted on the modified desired position and the first component connection surfaces (292, 294, 296) is increased; (G) moving the camera (340) to a second position within the first time period; (H) detecting, by means of the camera (340), a second image of a second section from the surface of the component support (150); (I) storing the second image; And (j) representing the second image for a second time period.The invention also relates to a method for fitting a component support (150), a computer program and an automatic placement machine (300), which are provided to perform the described method of modification.
Description
technical field [0001] The technical field to which the invention relates is the automatic assembly of electronic components to component carriers. In particular, the invention relates to a method for correcting a description of an at least partially unassembled component carrier to be assembled, which description includes desired data on the geometry of an electronic component to be mounted on the component carrier by means of an assembly process. The invention also relates to a method for assembling a component carrier (150), a computer program and an automatic assembly machine (300), which are designed to carry out said correction method. Background technique [0002] During the automatic assembly of electronic components on a component carrier by means of a so-called automatic assembly machine, these components are supplied to the assembly process by means of a so-called component supply device, these supplied electronic components are picked up by the assembly head and ...
Claims
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IPC IPC(8): H05K13/02
CPCH05K13/02H05K13/0818
Inventor 乔斯·卡洛斯·阿尔卡斯马丁·梅尔茨
Owner ASM ASSEMBLY SYST GMBH & CO