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Thin film punching machine and punching method

A technology of punching machine and film, applied in the field of film punching machine and punching, can solve the problems of serious mold loss and increased processing cost, and achieve the effects of long service life of equipment, uniform change of film tension and low processing cost

Active Publication Date: 2017-04-05
XI'AN INST OF OPTICS & FINE MECHANICS - CHINESE ACAD OF SCI
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  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

However, the mechanical processing method is suitable for the processing of thicker films due to its high dependence on film thickness, but it is not suitable for processing thin films, and the die loss used in mechanical processing is serious, which increases the processing cost.

Method used

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  • Thin film punching machine and punching method

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Embodiment Construction

[0025] In order to make the object, technical solution and advantages of the present invention more clear, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0026] A film punching machine, including a film transmission system and a laser processing system, the film transmission system includes an unwinding mechanism 1 and a winding mechanism 6 that are movably connected to the base through a guide, and the unwinding mechanism 1 and The winding mechanism 6 is respectively arranged on both sides of the processing table; the laser processing system is arranged on the film transmission system, and the laser processing system includes a laser 7, an optical transmission mechanism 8 and a processing head.

[0027] Such as figure 1 As shown, the film trans...

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Abstract

The invention relates to the technical field of laser processing equipment, in particular to a thin film punching machine. The thin film punching machine comprises a thin film conveying system and a laser processing system; the thin film conveying system comprises an unwinding mechanism and a winding mechanism which are movably connected to a base through a guiding piece; the unwinding mechanism and the winding mechanism are correspondingly arranged on the two sides of a processing table; and the laser processing system is arranged above the thin film conveying system and comprises a laser device, an optical path transmission mechanism and a processing head. According to the thin film punching machine, by arranging the unwinding mechanism and the winding mechanism, final motion of a thin film is achieved, the thin film can be kept smooth and not wrinkled in the moving process, and the tension of the thin film uniformly changes. By adopting laser punching, dependence on the thin film thickness in machining can be reduced, the condition that machining is not complete in the punching process can be reduced, the processing cost is low, and the equipment service life is long; and the hole distance and the hole type can be adjusted according to the actual requirement.

Description

technical field [0001] The invention relates to the technical field of laser processing equipment, in particular to a film punching machine and a punching method. Background technique [0002] At present, thin films are used in a wide range of fields, mainly in the fields of aviation and aerospace, consumer electronics, etc. Because thin films need to be processed with certain holes before use, the market has a large demand for thin film hole processing equipment. Some equipment is mainly in the form of mechanical processing. However, the mechanical processing method is suitable for the processing of thicker films because of its high dependence on film thickness, but it is not suitable for processing thin films, and the die loss for mechanical processing is serious, which increases the processing cost. Contents of the invention [0003] In order to overcome the above defects, the object of the present invention is to provide a film punching machine. [0004] A film punch...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B26F1/31B26D7/06B26D7/26
Inventor 李明王强赵卫江浩
Owner XI'AN INST OF OPTICS & FINE MECHANICS - CHINESE ACAD OF SCI
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