A low-temperature test method for the performance of glue in self-adhesive flooring
A technology of low-temperature testing and self-adhesive, which is applied in the direction of measuring devices, instruments, and mechanical devices, etc., can solve the problems of not being able to know self-adhesive flooring, etc., and achieve the effect of accurate adaptability and quality assurance
Active Publication Date: 2019-06-07
张家港隽新家居建材有限公司
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Problems solved by technology
There is no way to know whether the self-adhesive floor can adapt to the low temperature environment, that is, whether it will be firmly bonded to the base it is attached to in the low temperature environment
Method used
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[0020] The specific implementation of the low-temperature test method for the performance of glue in self-adhesive flooring according to the present invention will be described in detail below in conjunction with the accompanying drawings.
[0021] Such as Figure 4 As shown, the structure of the self-adhesive flooring includes: a bottom layer 43, a color filter layer 42 and a wear-resistant layer 41 arranged on the upper surface of the bottom layer 43 in sequence, and a glue layer 44 and a glue layer arranged on the lower surface of the bottom layer 43 in sequence. Release paper 45. The concrete steps of the low-temperature test method of glue performance in the self-adhesive floor are:
[0022] 1) According to the test requirements, cut out a test sample 4 of 12cm×12cm from the self-adhesive floor, and prepare a fixture for clamping the test sample 4. Its structure includes: a tensile test that matches the test sample 4 Plate 5, supporting plate 3 and clamping device;
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The invention discloses a low temperature testing method for glue properties of a self adhesive floor, and the method is used for testing adhesive fastness of the self adhesive floor in low temperature environment, and comprises the following steps: 1) cutting a test sample plate with a test required area from the self adhesive floor, and preparing a fixture matched with the test sample plate; 2); putting the test sample plate in the environment of 12 + / -2 DEG C for more than 1 hour, then taking the test sample plate out, and fixing the test sample plate together with a supporting board in the fixture on a clamping device in the fixture; and 3) removing release paper exposing from the clamping device part on the test sample plate, bonding with a prepared tensile test board, then pressing the tensile test board with a weight with a corresponding weight, keeping for 1 minute + / -10 seconds, then removing the weight, testing the tensile within 3 minutes, and recording a tensile value needed for separation of the tensile test board from the test sample plate. The low temperature testing method can be widely applied to low temperature detection of various products coated with glue.
Description
technical field [0001] The invention relates to a method for testing the properties of glue, in particular to a low-temperature test method for the properties of glue in self-adhesive flooring. Background technique [0002] At present, the glue performance in self-adhesive flooring is usually only tested at room temperature, but not at low temperature. There is no way of knowing whether the self-adhesive floor can adapt to the low temperature environment, that is, whether it is firmly bonded with the attached foundation in the low temperature environment. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a low-temperature test method for the performance of glue in self-adhesive flooring for testing the adhesion firmness of self-adhesive floorboards in a low-temperature environment. [0004] In order to solve the above-mentioned technical problems, the present invention adopts a low-temperature test method for the ...
Claims
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IPC IPC(8): G01N19/04
CPCG01N19/04
Inventor 袁立新
Owner 张家港隽新家居建材有限公司