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Foam clamping groove for packaging PCBA board and manufacturing and use methods of foam clamping groove

A foam card and card slot technology, applied in packaging and other directions, can solve problems such as environmental damage and waste, and achieve the effects of serious waste, simple structure and reliable design principle.

Inactive Publication Date: 2017-05-24
ZHENGZHOU YUNHAI INFORMATION TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If we still stay at the stage of designing special packaging materials for each PCBA board, it will inevitably cause a lot of waste, and the application of a large number of polyethylene foam materials will cause great damage to the environment

Method used

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  • Foam clamping groove for packaging PCBA board and manufacturing and use methods of foam clamping groove

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Embodiment Construction

[0031] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments. The following embodiments are explanations of the present invention, but the present invention is not limited to the following embodiments.

[0032] Such as figure 1 As shown, the present invention provides a foam card slot for packaging PCBA boards, which includes a base plate 1 and side plates 2, the side plates 2 are located at both ends of the base plate 1, and the base plate 1 and side plates 2 form a U Type slot structure, the bottom plate and the side plates are polyethylene foam boards, the bottom plate and the side plates are bonded together by hot melt adhesive, and the thickness of the bottom plate is greater than or equal to the thickness of the side plates.

[0033] In this embodiment, the polyethylene foam board contains antistatic material particles, so that the polyethylene foam board has an antistatic effect.

[0034] The polyet...

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PUM

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Abstract

The invention relates to a foam clamping groove for packaging a PCBA board. The foam clamping groove comprises a bottom plate and side plates. The foam clamping groove is characterized in that the side plates are located at the two ends of the bottom plate; a U-shaped clamping groove structure is formed by the bottom plate and the side plates; the bottom plate and the side plates are polyethylene foam plates and are cemented together through hot melt glue; and the thickness of the bottom plate is larger than or equal to the thickness of the side plates. The invention further provides a manufacturing method for manufacturing the foam clamping groove for packaging the PCBA board and a use method for the foam clamping groove for packaging the PCBA board.

Description

technical field [0001] The invention belongs to the technical field of packaging of PCBA boards, and specifically designs a foam slot for packaging PCBA boards and methods for making and using the same. Background technique [0002] At present, when PCBA board manufacturers design PCBA shipment packaging, they often design special packaging materials for different PCBA boards, so as to ensure that PCBA boards will not produce poor quality due to vibration and drop during shipment; The packaging material of the PCBA board in the technology is mainly pearl cotton made of polyethylene. This special packaging material is difficult to be applied to other PCBA boards after the life cycle of the PCBA board is over, resulting in a lot of waste. . Moreover, the structure of polyethylene is stable and cannot be degraded, which will damage the ecological environment. In addition, due to the specificity of packaging materials, each PCBA board needs to design a special packaging materi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65D81/107
CPCB65D81/107
Inventor 冯金星孙青华
Owner ZHENGZHOU YUNHAI INFORMATION TECH CO LTD
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