251results about How to "Avoid serious waste" patented technology

A flush toilet that uses a prescribed amount of cleansing water stored in a cleansing water tank to cleanse the toilet and discharge waste is disclosed. The flush toilet includes a bowl having a waste receiving surface, an overhanging rim and a shelf, a drainage channel whose inlet is connected to the bottom of the bowl for discharging waste, a first water spouting section for spouting cleansing water onto the shelf of the bowl to form a vortex; a second water spouting section for spouting cleansing water onto shelf of the bowl in the same direction as the swirling direction of the vortex, a first water channel for supplying cleansing water from the cleansing water tank to the first water spouting section, and a second water channel for supplying cleansing water from the cleansing water tank to the second water spouting section.

A stack type semiconductor apparatus package includes: (i) a first circuit substrate, (ii) a semiconductor apparatus package mounted on the first circuit substrate, (iii) a semiconductor apparatus, and (iv) a sealing resin for covering them. The first circuit substrate has a surface on which first connecting pads and second connecting pads are provided. The first connecting pads are connected to first external input / output terminals of the semiconductor apparatus package, and the second connecting pads are connected to electrodes of the first semiconductor apparatus, respectively. On a rear surface of the first circuit substrate, there are provided second external input / output terminals connected to the first connecting pads and the second connecting pads. The semiconductor apparatus package includes: a second circuit substrate, and a second semiconductor apparatus mounted on the second circuit substrate. On a surface of the second circuit substrate, there are provided third connecting pads connected to electrodes of the second semiconductor apparatus, respectively. The first external input / output terminals are provided on a rear surface of the second circuit substrate. This makes it possible to provide a stack type semiconductor apparatus package that can be easily manufactured with inexpensive cost.

A connector with two flanges for making a variety of connections between structural members, in particular cold formed steel structural members, with the added utility of a accommodating a heavy bolted connection to one of the structural members with an extended tab on one flange that matches a recess on the other for optimal material consumption and minimal waste in manufacturing.

Variable-format web-fed offset printing machine having printing-unit cylinders comprising core cylinders to which compressed air can be applied and onto which intermediate sleeves can be pushed axially and shrunk on radially. Each intermediate sleeve includes a carrier layer whose inner face rests on the core cylinder, a compressible intermediate layer, a transition layer, and a variable-thickness bridging layer, which ends with a covering layer to which a further surface like a printing plate or a rubber blanket can be fitted.

Use of a non-ionic surfactant in the preparation of modified sulfur and / or modified sulfur cement that may or may not be modified sulfur concrete.