Wafer scanning cleaning swing arm device

Abstract

The invention discloses a wafer scanning and cleaning swing arm device, which comprises a first casing and a support plate, a support plate is welded on the side wall of the first casing, a fixing seat is provided on the top of the support plate, and a fixing seat is provided on the top of the fixing seat. There is a first motor inside, the output shaft of the first motor is connected to an eccentric wheel, and three suction cups are attached to the top of the eccentric wheel, and a first connecting arm is arranged inside the first housing, and the first connecting arm is connected to the first shell The body is flexibly connected, the top of the first connecting arm extends to the top of the first housing, the top of the first connecting arm has a first groove, and the first cylinder is installed on the bottom side wall of the first groove. The piston rod of the air cylinder is welded with a second connecting arm, and the second connecting arm is slidably connected with the side wall of the first groove. The invention can clean both sides of the wafer, is convenient and quick to turn over, does not need manual operation, can scan and clean the wafer from multiple angles, has good cleaning effect and high working efficiency.

Description

technical field [0001] The invention relates to the technical field of wafer cleaning, in particular to a wafer scanning and cleaning swing arm device. Background technique [0002] Generally speaking, in the entire process of chip production, up to 20% of the steps are wafer cleaning. There are four common types of pollution on the wafer surface: fine particles, organic residues, inorganic residues, oxide layers that need to be removed, crystal The purpose of round cleaning is to remove organic compounds, metal impurities or fine particles attached to the surface of the wafer, and the oxide layer that needs to be removed. A wafer scanning and cleaning swing arm device is proposed in the patent CN104810310A, which solves the problem of When cleaning, the cleaning effect is poor, and there is a problem of cleaning dead angles, but it can only clean one side of the wafer, which requires manual flipping, which is inconvenient to clean, and it is inconvenient to adjust the clean...

AI Technical Summary

Problems solved by technology

[0002] Generally speaking, in the entire process of chip production, up to 20% of the steps are wafer cleaning. There are four common types of pollution on the wafer surface: fine particles, organic residues, inorganic residues, oxide layers that need to be removed, crystal The purpose of round cleaning is to remove organic compounds, metal impurities or fine particles attached to the surface of the wafer, and the oxide layer that needs to be removed. A wafer scanning and cleaning swing arm device is proposed in the patent CN104810310A, which solves the problem of When cleaning, the cleaning effect is poor, and there is a problem of cleaning dead angles, but it can only clean one side of the wafer, which requires manual flipping, which is inconvenient to clean, and it is inconvenient to adjust the cleaning angle of the wafer. Therefore, we propose A wafer scanning and cleaning swing arm device to solve the above problems

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