A cooling module and electrical equipment

Abstract

The invention provides a thermal module and electrical equipment. The electrical equipment comprises a shell, a heating unit and the thermal module, wherein the shell comprises a first outer surface, an internal space and a first opening, the first opening is communicated with the first outer surface and the internal space, the heating unit is arranged in the internal space of the shell, the thermal module comprises a heat conduction tube, a heat absorption block and a cooling fin, the heat absorption block is connected with the first end of the heat conduction tube, the cooling fin is connected to the second end of the heat conduction tube, the cooling fin is fixedly arranged on the first outer surface of the shell, and in installation, the heat absorption block can be fixed into the internal space from the first opening corresponding to the heating unit of the shell through deformation of the heat conduction tube. Therefore, the electrical equipment is convenient to assemble and stable in thermal radiating effect.

Description

technical field [0001] The invention relates to the field of heat dissipation modules and electrical equipment, in particular to an improved assembly structure of the heat dissipation module of electrical equipment. Background technique [0002] Generally, small electrical equipment with low power consumption (such as a computer) can be designed without a fan. The common method is to increase the heat sink on the central processing unit (CPU) and open a large number of ventilation holes in the case to take advantage of passive heat. Convection heat dissipation, but in actual operation, due to the appearance and function of the case, the proportion of openings on the case is limited, so it is mostly used for electrical equipment with CPU power consumption below 10W. [0003] In existing designs, see figure 1 , when the heat dissipation structure is designed, it is considered that the heat will be conducted to the outer surface of the housing 1a. In order to ensure that the c...

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Problems solved by technology

[0004] see you again figure 2 The main board 5a is fixed to the lower casing 12a of the casing 1a, and the upper casing 11a made of metal is provided with a protrusion 22b facing the central processing unit 4a to transfer the heat of the central processing unit 4a, and this assembly method makes The gap distance between the central processing unit 4a and the protrusion 22b is difficult to control. Only a thicker thermal pad can be used to form the protrusion 22b to absorb the assembly tolerance. A thicker thermal pad will reduce the heat conduction performance and will cause a long-term use. After that, the heat conduction pad hardens or there may be gaps, which will affect the heat conduction effect

or see image 3 , the heat pipe 23a is set between the shell 1a and the protrusion 22b, and there is also the problem of assembly tolerance to be overcome

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