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Slice scanning processing method and system for manufacturing three-dimensional object

A technology of three-dimensional objects and processing methods, applied in the field of additive manufacturing, can solve problems affecting molding accuracy and achieve the effect of improving scanning accuracy

Active Publication Date: 2017-06-13
HUNAN FARSOON HIGH TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In the prior art, the offset of the outline is generally realized by using line segment offset or point offset. However, since the slice layer often has thin walls or sharp areas, some areas in the slice layer offset by the above method are relatively narrow. Self-intersection occurs and is disposed of, resulting in a part of the slice layer that cannot be scanned and filled due to being disposed of, which affects the molding accuracy

Method used

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  • Slice scanning processing method and system for manufacturing three-dimensional object
  • Slice scanning processing method and system for manufacturing three-dimensional object
  • Slice scanning processing method and system for manufacturing three-dimensional object

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Embodiment Construction

[0034] In order to allow those skilled in the art to better understand and realize the technical solution of the present invention, further detailed description will be given below in conjunction with the accompanying drawings and specific embodiments.

[0035] figure 1 A method flowchart of an embodiment provided for the slice scanning method for three-dimensional object manufacturing of the present invention, such as figure 1 As shown, the method includes the following steps:

[0036] Step 11, offsetting the original contour to the solid part to obtain the offset contour;

[0037] Step 12, performing a Boolean operation on the offset contour to obtain at least one filling path;

[0038] Step 13. For each filling path, judge whether it satisfies the condition that it is opposite to the predefined trend of the outer contour in the original contour and whether the number of the contained contours is an even number; if it is satisfied, extract the main skeleton line of the fil...

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Abstract

The invention discloses a slice scanning processing method and system for manufacturing a three-dimensional object. The method comprises the following steps of: offsetting an original profile to a solid part to obtain an offset profile; carrying out Boolean operation on the offset profile to obtain at least one filling path; respectively judging whether each filling path meets the condition that the predefining direction is opposite to that of the outer profile in the original profile and the number of contained profiles is even; and when meeting the condition, extracting a main skeleton line of the filling path and using the main skeleton line as a path to be scanned; or, using the filling path as an area to be scanned. The slice scanning processing method and system disclosed by the invention have the advantages that the defect that loss of scanning of partial areas is caused by profile offsetting to influence the scanning accuracy in the traditional method is overcome, so that the scanning accuracy for the three-dimensional object is greatly increased.

Description

technical field [0001] The invention belongs to the technical field of additive manufacturing, and in particular relates to a slice scanning processing method and system for three-dimensional object manufacturing. Background technique [0002] Additive Manufacturing technology (Additive Manufacturing, referred to as AM) is an advanced manufacturing technology with distinctive features such as digital manufacturing, high flexibility and adaptability, direct CAD model drive, fast speed, and rich and diverse material types. The degree of limitation does not require any tooling and molds, so the application range is very wide. Selective Laser Melting (SLM) is one of the additive manufacturing technologies that has developed rapidly in recent years. It uses powder materials as raw materials and uses laser to scan the cross-section of a three-dimensional entity layer by layer to complete prototype manufacturing. The complexity of the shape is limited, no tooling and molds are req...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F3/105B33Y10/00B33Y30/00B33Y50/02
CPCB22F3/003B33Y10/00B33Y30/00B33Y50/02B22F10/10B22F10/00B22F10/366B22F10/20Y02P10/25
Inventor 许小曙王朝龙杨大风
Owner HUNAN FARSOON HIGH TECH CO LTD