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Method for cutting sheet material and device for cutting sheet material

A wire cutting and plate cutting technology, which is applied in the direction of manufacturing tools, grinding machines, grinding/polishing equipment, etc., can solve problems such as unusable workpieces, cracked cuts, and inability to complete cutting tasks

Active Publication Date: 2020-11-06
DONGXU OPTOELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the superhard material of silicon carbide, conventional cutting tools are used for conventional cutting, and the incision cracks often occur when the cut is about to be cut through, resulting in unusable workpieces and excessive wear of cutting tools, making it impossible to complete the cutting task.

Method used

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  • Method for cutting sheet material and device for cutting sheet material
  • Method for cutting sheet material and device for cutting sheet material
  • Method for cutting sheet material and device for cutting sheet material

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Embodiment Construction

[0033] Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.

[0034] refer to Figure 1 to Figure 3 , the invention provides a method for cutting boards. Since the silicon carbide plate is super hard and difficult to cut, the cutting method provided by the present invention is especially suitable for cutting silicon carbide plates, but is not limited to cutting silicon carbide plates, but is suitable for all high-strength, easy-to-crack plates.

[0035] According to an embodiment of the present invention, before cutting the board 100 , the cutting line is firstly determined on the surface of the board 100 . The purpose of determining the cutting line is to provide an operation path for the cutting operation and make the ...

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Abstract

The invention discloses a method for plate cutting. The method comprises the following steps that cutting lines are determined on the surfaces of a plate (100); a first groove (101) is cut on the surface of one side of the plate (100) along the corresponding cutting line, and the groove depth of the first groove is less than half of the thickness of the plate; a second groove (102) is cut on the surface of the other side of the plate along the corresponding cutting line, and the groove depth of the second groove is less than half of the thickness of the plate, so that a non-cutting-off anti-breakup part (103) extending in the extending direction of the cutting lines is formed on a cutting face; and the anti-breakup part is cut along the plate thickness cut-through direction, so that the length of the anti-breakup part in the extending direction of the cutting lines is gradually shortened till the anti-breakup part is completely cut off. The invention further provides a device for plate cutting. By adoption of the method and device for plate cutting, the problem that breakup is prone to occurring when the high-strength plate is cut through conventional means can be solved.

Description

technical field [0001] The invention relates to the field of glass manufacturing, in particular to a method for cutting a plate and a device for cutting the plate. Background technique [0002] High-precision silicon carbide refractory materials are required in the production line of liquid crystal glass substrates. Traditional silicon carbide workpieces are shaped first and then sintered. The sintered silicon carbide has superhard material properties, its hardness is between corundum and diamond, and its mechanical strength is higher than that of corundum. The silicon carbide plates used in the liquid crystal glass substrate production line are of various shapes and sizes and need to be cut. Due to the ultra-hard material of silicon carbide, common cutting tools are used for conventional cutting, and the incision often cracks when it is about to cut through, resulting in unusable workpieces and excessive wear of cutting tools, making it impossible to complete the cutting t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B27/06B24B1/00B24B41/06
CPCB24B1/00B24B27/0675B24B27/0683B24B41/068
Inventor 何邦明姜文成王丽红郑权
Owner DONGXU OPTOELECTRONICS TECH CO LTD