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Display device

A display device and display panel technology, applied to static indicators, instruments, etc., can solve problems such as different performance

Active Publication Date: 2017-06-20
HIMAX TECH LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the performance measured at these two endpoints is not the same, usually the actual performance of the driver chip will be higher than the measured performance

Method used

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Embodiment Construction

[0017] The terms "first", "second", etc. used herein do not specifically refer to a sequence or order, but are only used to distinguish elements or operations described with the same technical terms.

[0018] Figure 1A is a side view illustrating a display panel according to an embodiment. Figure 1B is a top view illustrating a display panel according to an embodiment. Please refer to Figure 1A and Figure 1B , the display device 100 includes a display panel 110 , a chip 120 , a film-on-chip packaging structure 130 and a circuit board 140 . The display device 100 can be implemented as a TV, mobile phone screen, computer screen, etc., or the display device 100 can also be implemented as a semi-finished product (eg, not including a casing), and the present invention does not limit what product the display device 100 can be implemented as.

[0019] The display panel 110 may be a liquid crystal (Liquid Crystal Display, LCD) display panel, an organic light-emitting diode (Orga...

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Abstract

The invention provides a display device which comprises a display panel, a wafer, a circuit board and a chip-on-film packaging structure. The chip-on-film packaging structure is connected between the display panel and the circuit board. The wafer is arranged on the chip-on-film packaging structure. The chip-on-film packaging structure comprises a first signal line and a second signal line which are connected with the wafer, wherein the distance between the first signal line and the second signal line is larger than line widths of the first signal line and the second signal line.

Description

technical field [0001] The present invention relates to a display device, and more particularly to a display device for compensating the characteristic impedance of a chip on film (COF) package. Background technique [0002] In some display devices, in order to meet the narrow frame requirements, the display panel is connected to a circuit board with a time controller through a chip-on-film packaging structure, and a driving chip is disposed on the chip-on-chip package structure. Generally speaking, if the performance of the driver chip is to be measured, the test point should be located on the driver chip. However, since it is not easy to measure the signal on the thin film package structure, the test point is usually set on the circuit board. However, the performance measured at these two endpoints is not the same, and usually the actual performance of the driver chip will be higher than the measured performance. Therefore, those skilled in the art are still looking for a...

Claims

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Application Information

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IPC IPC(8): G09G3/20
Inventor 官圣洧
Owner HIMAX TECH LTD