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Package and manufacturing method thereof

A packaging and bonding technology, used in semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, electrical components, etc., can solve problems such as failure, delamination, and weak bonding between the molding compound and the solder joint of the substrate. , to avoid the effect of easy delamination

Inactive Publication Date: 2017-06-30
SAMSUNG SEMICON CHINA RES & DEV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although this type of package can easily control the dimensional accuracy of the package, the bonding force between the molding compound and the solder joints of the substrate is weak, and delamination is easy to occur, resulting in failure

Method used

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  • Package and manufacturing method thereof
  • Package and manufacturing method thereof
  • Package and manufacturing method thereof

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Embodiment Construction

[0031] Hereinafter, the inventive concept will be described in detail by explaining exemplary embodiments with reference to the accompanying drawings. However, the inventive concepts may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will inform the present Those of ordinary skill in the art fully convey the inventive concept. In the drawings, the same reference numerals denote the same elements. Furthermore, various elements and regions are shown schematically. Accordingly, the inventive concepts are not limited to the relative sizes or distances shown in the drawings. It will be understood that although the terms first, second, third etc. may be used herein to describe various elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not limited by ...

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Abstract

The invention provides a package and a manufacturing method thereof. The package comprises a substrate, first and second engaging elements, a chip, a stopper and an encapsulating member. The substrate is provided with a first surface and a second surface back to the first surface. A number of pads are arranged in the substrate. First and second engaging elements are arranged on the substrate. The second engaging element is arranged around the first engaging element. The chip is arranged on the first engaging element and is electrically connected with a number of pads through a lead wire. The stopper is arranged on the second engaging element. The encapsulating member is arranged on the inner side of the stopper to enclose the chip, the first engaging element and the lead wire.

Description

[0001] This application is a divisional application of the application number 201510295917.3 submitted to the State Intellectual Property Office on June 2, 2015. technical field [0002] The invention relates to the packaging field, in particular to a package and a method for manufacturing the package. Background technique [0003] Existing packaging technology usually adopts glue dispensing or molding to provide protection for the chip and prevent the chip from becoming invalid due to environmental impact and external force. [0004] figure 1 A schematic cross-sectional view of a dispensing package of the related art is shown, in which a chip 102 is disposed on a bonding member 101a through an adhesive layer A including a bonding agent, and a lead W is used to connect the chip 102 to a bonding pad disposed on a substrate 100. The pads (not shown) are electrically connected, and then encapsulated with the encapsulation member 103 by dispensing glue. Dispensing packaging is...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/16H01L23/24H01L23/31H01L23/498H01L21/60
CPCH01L23/49855H01L24/29H01L24/32H01L24/48H01L24/73H01L24/92H01L23/16H01L23/24H01L23/3142H01L2224/2919H01L2224/32225H01L2224/32238H01L2224/73265H01L2224/48227H01L2224/48228H01L2224/48229H01L2924/00012H01L2224/92227H01L2924/15162H01L2924/00
Inventor 徐健
Owner SAMSUNG SEMICON CHINA RES & DEV
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