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Push-down ic chip detection mechanism

A chip detection and chip technology, applied in the field of push-down IC chip detection mechanisms, can solve problems such as chip loosening or displacement, and inaccurate detection results.

Active Publication Date: 2019-05-10
FUZHOU PALIDE ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The IC chip detection in the existing sorting machine, such as the integrated circuit chip multi-station serial belt marking test sorting device provided by the application number 201610760891X, detects the chip through the test station arranged on the feeding track groove, and at the same time The detected chips are sorted by the sorting shuttle, but in the process of detection, it is easy to cause the chips to loosen or shift, resulting in inaccurate detection results

Method used

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  • Push-down ic chip detection mechanism
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  • Push-down ic chip detection mechanism

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Embodiment Construction

[0021] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0022] Such as Figure 1~5 As shown, a push-down IC chip detection mechanism includes two push-down mechanisms arranged side by side between the feeding track grooves 8 for pressing down the IC chips for detection, and two correspondingly arranged on the feeding track grooves 8 The detection board 6 that cooperates with two pressing mechanisms below respectively; Each detection board 6 is provided with the golden finger 11 that cooperates with IC chip to detect; The contacted lower pressure cylinder 2 and the limit cylinder 1 used to limit the upward stroke of the lower pressure cylinder 2; the output shaft of the limit cylinder 1 is fixedly connected with a downward limit block 100; the output of the lower pressure cylinder 2 A baffle 23 is fixed on the upper part of the shaft, and a pressing part 21 is fixedly connected to the lower end. A c...

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Abstract

The invention relates to a downward pressing type IC chip detection mechanism including two downward pressing mechanisms and two detection plates, each detection plate is provided with a golden finger, each downward pressing mechanism includes a downward cylinder and a limiting cylinder, the output shaft of each limiting cylinder is fixedly connected with a limiting block, a baffle board is fixed at the upper part of the output shaft of each downward cylinder, the lower end is fixedly connected to the pressing part, a clamping part is movably arranged between the pressing part and the baffle board, a support spring is arranged between the clamping part and the pressing part, the front and rear sides of the clamping part extend downwards to be provided with a front extension part and a rear extension part, the pressing part is arranged between the front extension part and the rear extension part, the bottom ends of the front extension part and the rear extension part are fixedly connected with an accommodating groove, the accommodating groove is jointed with a feeding track groove, the lower part of the pressing part is provided with a downward baffle plate, and the upper surface of the accommodating groove is correspondingly provided with a through hole cooperated with the baffle plate. The IC chip detection can be realized through the cooperation of the limiting cylinders and the downward cylinders, and the detection efficiency is improved.

Description

technical field [0001] The invention relates to a push-down type IC chip detection mechanism. Background technique [0002] The IC chip detection in the existing sorting machine, such as the integrated circuit chip multi-station serial belt marking test sorting device provided by the application number 201610760891X, detects the chip through the test station arranged on the feeding track groove, and at the same time The detected chips are sorted by the sorting shuttle, but during the detection process, it is easy to cause the chips to loosen or shift, resulting in inaccurate detection results. Contents of the invention [0003] The object of the present invention is to provide a push-down IC chip detection mechanism to improve the detection effect. [0004] The solution adopted by the present invention to solve the technical problem is: a push-down IC chip detection mechanism, including two push-down mechanisms arranged side by side between the feeding track grooves for p...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/28
CPCG01R31/2886G01R31/2891
Inventor 谢名富吴成君
Owner FUZHOU PALIDE ELECTRONICS TECH