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Connecting arrangement for a lithography system

A technology of connection configuration and lithography system, applied in the field of connection configuration of lithography system

Active Publication Date: 2017-08-01
CARL ZEISS SMT GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Because this separation effect is directly related to mechanical stiffness, this procedure is limited to systems requiring high mechanical stiffness

Method used

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  • Connecting arrangement for a lithography system
  • Connecting arrangement for a lithography system
  • Connecting arrangement for a lithography system

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Experimental program
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Embodiment Construction

[0049] Unless otherwise indicated, like reference numbers in the figures identify identical or functionally equivalent elements. Further, please note that the representations in the figures are not necessarily to scale.

[0050] figure 1 A schematic diagram of an EUV lithography system 100 including a beam shaping system 102 together with an illumination system 104 and a projection system 106 is shown. The beam shaping system 102, the illumination system 104 and the projection system 106 are respectively provided in a vacuum enclosure which is evacuated by means of an evacuation device (not shown in detail). The vacuum enclosure is surrounded by a mechanical space (not shown in detail) in which devices for mechanical movement or adjustment of the optical elements are provided. Within the mechanical space further electrical controls and the like can be provided.

[0051] The beam shaping system 102 has an EUV light source 108 , a collimator 110 and a monochromator 112 . For...

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Abstract

A connecting arrangement (200A, 200B) for a lithography system (100) is disclosed, which has a first component (212), a second component (206), a first interface element (210), which is releasably connected to the first component (212) at a first junction (220), and a second interface element (218), which is releasably connected to the second component (206) at a second junction (222). The first interface element (210) has a first contact surface (226), the second interface element (218) has a second contact surface (228), and at least one of the two contact surfaces (226, 228) is configured in order to be aligned and / or selected in order to compensate for an offset between the first component (212) and the second component (206) before the two contact surfaces (226, 228) are connected at a third junction (224). The first contact surface (226) of the first interface element (210) and the second contact surface (228) of the second interface element (218) are connected by means of a material-fit connection at the third junction (224).

Description

[0001] Cross References to Related Applications [0002] This application claims priority from German Patent Application No. 10 2014 225 199.0 filed on December 9, 2014. The entire content of this German patent application is hereby incorporated by reference. technical field [0003] The present invention relates to connection configurations, lithographic systems having connection configurations and methods of manufacturing connection configurations. Background technique [0004] Because of materials and manufacturing, a lens is made up of many components, especially the carrying structure and optics. Thus, the carrier structure is connected to the optical device via the connection point. Depending on the way in which the junction is made, stresses and deformations can occur which can have detrimental effects on the optical device. Especially because of the minimum mechanical strength requirements, assembly without stress and deformation has hitherto been almost impossibl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/20
CPCG03F7/70825G02B7/00G03F7/70833
Inventor D.谢弗J.普罗赫纳A.沃姆布兰德
Owner CARL ZEISS SMT GMBH