Laminated chip power distribution module and manufacturing method thereof

A technology for distributing modules and power, applied in the field of electronics, can solve the problems of large space occupation, large insertion loss, inconvenient assembly, etc., and achieve the effects of high installation efficiency, low insertion loss and high reliability
CN107039733BActive Publication Date: 2022-04-29SHENZHEN ZHENHUA FU ELECTRONICS +1

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SHENZHEN ZHENHUA FU ELECTRONICS
Publication Date
2022-04-29

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Abstract

The invention provides a laminated chip power distribution module, which includes an input electrode, an output electrode, an upper cover, a lower cover and an intermediate layer. The intermediate layer includes an internal electrode of a bypass capacitor, a power distribution coil and an internal electrode of a coupling capacitor, and the power distribution coil There are at least two and connected in parallel; one end of the inner electrode of the bypass capacitor is connected to the common end of the power distribution coil, and the other end is grounded; the common end of the power distribution coil is connected to the input electrode, and the non-common end of each power distribution coil is connected to a Output electrodes; an inner electrode of a coupling capacitor and an isolation resistor are connected between the non-common ends of every two parallel power distribution coils, and the isolation resistor is arranged in the installation groove of the upper cover and connected to the output electrodes. In the present invention, the inner electrode of the bypass capacitor, the power distribution coil and the inner electrode of the coupling capacitor are laminated between the upper cover and the lower cover. Excellent balance, meeting assembly and electrical performance requirements.
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Description

technical field

[0001] The invention belongs to the field of electronic technology, in particular to a laminated chip power distribution module and a manufacturing method thereof. Background technique

[0002] With the rapid development of electronic equipment in the direction of miniaturization, light weight and integration, the volume of electronic complete machines and systems is getting smaller and smaller, and the installation density of components is also increasing. direction of development. The microwave power distribution module is a component that divides the energy of one input signal into two or more outputs with equal or unequal energy. Traditional power distribution modules are mostly assembled devices with large volume, complicated installation methods, large insertion loss, and low isolation, which cannot meet the requirements in terms of performance and assembly methods. Therefore, it is necessary to propose a new type of power distribution module to solve ...

Claims

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