Laminated chip power distribution module and manufacturing method thereof
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SHENZHEN ZHENHUA FU ELECTRONICS
- Publication Date
- 2022-04-29
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Abstract
Description
technical field
[0001] The invention belongs to the field of electronic technology, in particular to a laminated chip power distribution module and a manufacturing method thereof. Background technique
[0002] With the rapid development of electronic equipment in the direction of miniaturization, light weight and integration, the volume of electronic complete machines and systems is getting smaller and smaller, and the installation density of components is also increasing. direction of development. The microwave power distribution module is a component that divides the energy of one input signal into two or more outputs with equal or unequal energy. Traditional power distribution modules are mostly assembled devices with large volume, complicated installation methods, large insertion loss, and low isolation, which cannot meet the requirements in terms of performance and assembly methods. Therefore, it is necessary to propose a new type of power distribution module to solve ...