A laminated chip power distribution module and its manufacturing method

Abstract

The invention provides a laminated chip power distribution module, which includes an input electrode, an output electrode, an upper cover, a lower cover, and an intermediate layer, and the intermediate layer includes an inner electrode of a bypass capacitor, a power distribution coil, and an inner electrode of a coupling capacitor arranged in layers. , the number of power distribution coils is at least two and connected in parallel with each other; one end of the inner electrode of the bypass capacitor is connected to the common end of the power distribution coil, and the other end is grounded; the common end of the power distribution coil is connected to the input electrode, and the non- The common end is connected with an output electrode; an inner electrode of a coupling capacitor and an isolation resistor are connected between the non-common ends of every two parallel power distribution coils. In the present invention, the inner electrode of the bypass capacitor, the power distribution coil and the inner electrode of the coupling capacitor are laminated between the upper cover and the lower cover. High isolation, excellent phase and amplitude balance, meeting both assembly requirements and electrical performance requirements.

Description

technical field

[0001] The invention belongs to the field of electronic technology, in particular to a laminated chip power distribution module and a manufacturing method thereof. Background technique

[0002] With the rapid development of electronic equipment in the direction of miniaturization, light weight and integration, the volume of electronic complete machines and systems is getting smaller and smaller, and the installation density of components is also increasing. direction of development. The microwave power distribution module is a component that divides the energy of one input signal into two or more outputs with equal or unequal energy. Traditional power distribution modules are mostly assembled devices with large volume, complicated installation methods, large insertion loss, and low isolation, which cannot meet the requirements in terms of performance and assembly methods. Therefore, it is necessary to propose a new type of power distribution module to solve ...

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