A laminated chip power distribution module and its manufacturing method
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SHENZHEN ZHENHUA FU ELECTRONICS
- Publication Date
- 2022-04-29
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Abstract
Description
Technical field
[0001] The invention belongs to the technical field of electronics, in particular to a laminated power distribution module and a manufacturing method thereof. technical background
[0002] With the rapid development of electronic equipment in the direction of miniaturization, light weight and integration, the volume of the whole electronic machine and system is getting smaller and smaller, and the installation density of components is getting larger and larger, which requires the corresponding components to develop towards miniaturization. Microwave power distribution module is a component that divides one input signal energy into two or more paths to output equal or unequal energy. Most of the traditional power distribution modules are assembled devices, which are bulky, complicated in installation mode, high in insertion loss and low in isolation. Therefore, a new type of power distribution module needs to be proposed to solve the above problems. Inventive cont...