A laminated chip power distribution module and its manufacturing method

A technology for distributing modules and power, which is applied in the electronic field, can solve the problems of large insertion loss, large space occupation, and inconvenient assembly, and achieve the effects of small insertion loss, high installation efficiency, and high reliability
CN107039734BActive Publication Date: 2022-04-29SHENZHEN ZHENHUA FU ELECTRONICS +1

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SHENZHEN ZHENHUA FU ELECTRONICS
Publication Date
2022-04-29

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

The invention provides a laminated chip power distribution module, which includes an input electrode, an output electrode, an upper cover, a lower cover, and an intermediate layer, and the intermediate layer includes an inner electrode of a bypass capacitor, a power distribution coil, and an inner electrode of a coupling capacitor arranged in layers. , the number of power distribution coils is at least two and connected in parallel with each other; one end of the inner electrode of the bypass capacitor is connected to the common end of the power distribution coil, and the other end is grounded; the common end of the power distribution coil is connected to the input electrode, and the non- The common end is connected to an output electrode; the non-common end of every two parallel power distribution coils is connected to an inner electrode of a coupling capacitor. In the present invention, the inner electrodes of the bypass capacitor, the power distribution coil and the inner electrode of the coupling capacitor are laminated between the upper cover and the lower cover. The overall product is highly integrated, small in size, easy to assemble, good in weldability, and suitable for high-density surface mounting. Small insertion loss, high isolation, excellent phase balance and amplitude balance, which meet both assembly requirements and electrical performance requirements.
Need to check novelty before this filing date? Find Prior Art

Description

Technical field

[0001] The invention belongs to the technical field of electronics, in particular to a laminated power distribution module and a manufacturing method thereof. technical background

[0002] With the rapid development of electronic equipment in the direction of miniaturization, light weight and integration, the volume of the whole electronic machine and system is getting smaller and smaller, and the installation density of components is getting larger and larger, which requires the corresponding components to develop towards miniaturization. Microwave power distribution module is a component that divides one input signal energy into two or more paths to output equal or unequal energy. Most of the traditional power distribution modules are assembled devices, which are bulky, complicated in installation mode, high in insertion loss and low in isolation. Therefore, a new type of power distribution module needs to be proposed to solve the above problems. Inventive cont...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More