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Power amplifier module supporting hot plugging

A power amplifier, hot-swappable technology, applied in the fields of satellite communication, microwave communication and scattering communication, which can solve the problems of poor system redundancy, low output power of a single power device, and modules that do not support hot-swapping, etc., to increase reliability. , the effect of improving programmability and increasing power synthesis efficiency

Active Publication Date: 2017-08-18
NO 54 INST OF CHINA ELECTRONICS SCI & TECH GRP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to provide a power amplifier module that supports hot swapping, which solves the shortcomings of low output power of a single power device in the prior art, the module does not support hot swapping, and poor system redundancy

Method used

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  • Power amplifier module supporting hot plugging
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  • Power amplifier module supporting hot plugging

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Embodiment Construction

[0029] The present invention will be further described in detail below with reference to the drawings and specific embodiments.

[0030] Such as figure 1 As shown, a power amplifier module supporting hot plugging of the present invention includes a power amplifier 1, a high and low frequency mixed connector assembly 2, a radiator 3, and a power amplifier module support shell 4. The power amplifier 1, the high and low frequency mixed connector assembly 2 and the radiator 3 are fixed on the power amplifier module holder 4 with screws. The output, power supply and communication interface of the power amplifier module holder 4 are on the same side. The entire module can be positioned by mounting rails and pins to facilitate connection with the combiner and the chassis motherboard. The heat sink 3 is directly connected with the power amplifier 1 for the power amplifier 1 to dissipate heat.

[0031] figure 2 Shown is a block diagram of the power amplifier module of the present inventio...

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Abstract

The invention discloses a power amplifier module supporting hot plugging, and relates to the field of satellites and microwave communication. The power amplifier module is composed of a power amplifier, a high-low frequency mixedly loaded connector assembly, a radiator and a power amplification module support shell. The module adopts a plane power synthesis technology, and two last-stage power amplifier modules are synthesized via a 3dB bridge coupler. The module is provided with complete detection and control functions, can detect input and output power, working voltage current and temperature of the power amplifier module in real time, and can also communicated with a 485 interface to receive the control of an upper computer. The module designs a hot plugging power management circuit, supports hot plugging of the equipment, and increases system redundancy.

Description

Technical field [0001] The present invention relates to the fields of satellite communication, microwave communication and scattering communication, in particular to a power amplifier module supporting hot plugging, which can be widely used in power amplifier systems based on spatial power synthesis. Background technique [0002] In recent years, with the rapid development of wireless communication technology, requirements for bandwidth, efficiency, and output power of power amplifiers have also increased day by day. However, solid-state power devices are affected by the physical characteristics of their own semiconductors and are limited by processing technology, heat dissipation, impedance matching and other issues. The device output power is very limited, and the higher the operating frequency, the lower the single-chip output power level. Therefore, people use multiple solid-state power devices for power synthesis to effectively increase the output power of the power amplifie...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03F1/52H03F3/19H03F3/21H03F3/24G06F13/40G01R21/133G01R19/25G01K1/02G01K1/024
CPCH03F1/52H03F3/19H03F3/21H03F3/24G06F13/4081G01K1/024G01R19/2513G01R21/133H03F2200/451Y02D30/70
Inventor 李楠杨作成张志忠王晓龙张静朱秀敏王晓明杨贺
Owner NO 54 INST OF CHINA ELECTRONICS SCI & TECH GRP
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