Preparing method and device of printed circuit board
A technology for printed circuit boards and preparation devices, which is applied in the fields of printed circuit manufacturing, printed circuits, electrical components, etc. It can solve the problems of difficult placement and removal of backing boards, slow production efficiency and work efficiency, etc., to improve production efficiency and work efficiency. efficiency effect
Active Publication Date: 2017-08-18
珠海杰赛科技有限公司 +1
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Problems solved by technology
[0004] The embodiment of the present invention provides a method and device for preparing a printed circuit board, which is used to solve the problem that the pit size in the prior art is too small and the method of using FR-4 will make it difficult to place and take out the backing board, resulting in The problem of efficiency and slow work efficiency
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[0032] The technical solutions of the present invention will be described in detail below through the accompanying drawings and specific embodiments. It should be understood that the embodiments of the present invention and the specific technical features in the embodiments are only descriptions of the technical solutions of the present invention, rather than limitations. , the embodiments of the present invention and specific technical features in the embodiments may be combined with each other.
[0033] like figure 2 Shown is a flow chart of a method for preparing a printed circuit board in an embodiment of the present invention, the method comprising:
[0034] S201, determine the structure information of the groove on the printed circuit board;
[0035] S202, according to the structure information, open a through hole on the aluminum sheet and the cover plate;
[0036] S203. Cover the aluminum sheet and the cover plate on the printed circuit board, and drill holes in the...
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The invention discloses a preparing method and device of a printed circuit board. The method comprises the steps of determining structural information of a groove in the printed circuit board; according to the structural information, forming through holes in an aluminum sheet and a cover plate; covering the printed circuit board with the aluminum sheet and the cover plate, and drilling holes in the groove through the through holes in the aluminum sheet and the cover plate. Through the preparing method and device of the printed circuit board, the problems that it is both difficult to place the groove with a small size on the printed circuit board and take out a backing are solved, moreover, the aluminum sheet and the cover plate which cover the printed circuit board are subjected to drilling, milling and windowing machining on the position corresponding to the groove so that dust cannot be blocked by the aluminum sheet and the cover plate and left in the groove, and can be further sucked away along with a dust suction pipe on a main axis of a drilled hole, and therefore, through the method, the production efficiency and work efficiency of the printed circuit board are improved.
Description
technical field [0001] The present application relates to the field of printed circuit board manufacturing, in particular to a method and device for preparing a printed circuit board. Background technique [0002] At present, when ordinary printed circuit boards are processed in the drilling process, there is no special control method for the dust generated by drilling; and when the printed circuit board has a more complex design structure, there are pits on the printed circuit board. Design, when the hole needs to be drilled in the pit, a large amount of dust will remain in the pit and cannot be discharged, which will affect the quality of the post-production process of the product. [0003] In the current industry, the processing of this type of printed circuit board is to place the FR-4 backing plate in the pit to be flush with the board surface, such as figure 1 shown; but this method is suitable for products with larger pits. If the pit size is too small, it will be di...
Claims
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IPC IPC(8): H05K3/00
CPCH05K3/0047H05K3/0055
Inventor 胡伦洪关志峰李超谋任代学
Owner 珠海杰赛科技有限公司