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Flexible stage for high precision passive alignment for near-field scanning lithography

It is a near-field scanning and high-precision technology, which is applied in the direction of optics, pattern surface photolithography, instruments, etc. It can solve problems such as unfavorable calibration, secondary interference, cumbersome operation, etc., and achieve improved alignment efficiency and fast passive calibration. Effect

Active Publication Date: 2018-11-13
UNIV OF SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

During this process, the operation is cumbersome, the cost is high, and there may be secondary interference, which is not conducive to efficient and real-time calibration

Method used

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  • Flexible stage for high precision passive alignment for near-field scanning lithography
  • Flexible stage for high precision passive alignment for near-field scanning lithography
  • Flexible stage for high precision passive alignment for near-field scanning lithography

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specific Embodiment approach

[0019] The preferred embodiment of the high-precision passive alignment flexible stage applied to near-field scanning lithography of the present invention is:

[0020] It includes an upper table, a lower table, and a base. The upper table and the lower table are connected by double orthogonal flexible hinges. The mask is adsorbed on the lower table through a vacuum suction chamber, and then placed on the base.

[0021] The bi-orthogonal flexible hinge includes two orthogonal perfect circular flexible hinges.

[0022] The four corners of the upper table and the lower table are respectively connected by double orthogonal flexible hinges and partial single cylinder hinges.

[0023] In the existing scanning lithography technology, ensuring the alignment of the mask and the substrate is the most important thing. During the design, it is necessary to ensure that the rotation center of the lithography head is always at the center of the mask to prevent relative displacement between ...

specific Embodiment

[0046] image 3 It is an improved double-hinge component structure suitable for lithography alignment. The appropriate circular hinge width b, curvature R and thickness t can be selected by empirical Schotborgh’s formula to meet the stiffness requirements.

[0047] exist Figure 4 In the shown embodiment, the entire flexible component is composed of the upper table ①, the bi-orthogonal flexible hinge ②, the lower table ③ and other connecting rods. The rod is transferred and dispersed on ③; the mask ⑤ is adsorbed on the lower end table ③ of the flexible part through the vacuum adsorption chamber ④.

[0048] Figure 1a In the shown embodiment, the ideal tight contact between the mask ⑤ and the substrate ⑥ was not achieved at the beginning of placement; when the external load pressure is transmitted and dispersed to the interior of the flexible part through the entire flexible part, the mask ⑤ and the substrate are finally realized. ⑥ close contact between, such as Figure 1b sh...

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Abstract

The invention discloses a high-precision passive alignment flexible platform applied to near-field scanning lithography. The high-precision passive alignment flexible platform comprises an upper end platform surface, a lower end platform surface and a base, wherein the upper end platform surface and the lower end platform surface are connected through a biorthogonal flexible hinge; a mask is adsorbed on the lower end platform surface through vacuum adsorption and then is placed on the base; and the biorthogonal flexible hinge comprises two orthogonal perfect circle flexible hinges. In the operating process, certain normal pressure is generated from the mask plate and the base contact surface, and then the normal pressure is scattered and transferred by each hinge in the part so as to enable the mask fixed on the lower end platform surface to be in dynamic and passive tight contact with the base on the lower part, so that the alignment efficiency of a lithography apparatus is effectively improved; and superabundant photoelectric sensors do not exist, so that passive alignment can be realized at the highest speed without lowering the alignment precision.

Description

technical field [0001] The invention relates to a device for aligning a mask and a substrate in near-field scanning lithography, in particular to a flexible table for high-precision passive alignment applied to near-field scanning lithography. Background technique [0002] In the alignment method of the prior art, it is generally used to assist some photoelectric or dynamic sensors on the mask, and the information transmitted by the sensor in real time is used to obtain the alignment of the mask and the substrate, and through these feedbacks The information is used to actively calibrate the mask or substrate to achieve ideal alignment requirements. During this process, the operation is cumbersome, the cost is high, and there may be secondary interference, which is not conducive to efficient and real-time calibration. In addition, considering the requirements for application in near-field scanning lithography, it is necessary to provide an improved automatic alignment techno...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F9/00
CPCG03F9/7038
Inventor 王亮张亮秦金谭浩森许凯
Owner UNIV OF SCI & TECH OF CHINA