Automatic aligner

A technology of automatic alignment and alignment holes, which is applied in the direction of exposure devices, instruments, electrical components, etc. in the photoplate making process, can solve the problems of unsatisfactory alignment errors, increase production costs, and time-consuming, so as to meet strict requirements and avoid Error, the effect of improving alignment efficiency
CN101452228AInactive Publication Date: 2009-06-10AVARY HLDG (SHENZHEN) CO LTD +1

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
AVARY HLDG (SHENZHEN) CO LTD
Publication Date
2009-06-10
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention provides an automatic aligning device which comprises a base platform, a bearing platform, an elevating device and a support member connecting the base platform and the bearing platform. The bearing platform is provided with at least one aligning through hole. The elevating device comprises a brake part and an elevating platform connected with the brake part. The elevating device has at least one brake part which is fixed on the base platform and is used for controlling the elevating platform to rise and fall between the base platform and the bearing platform. The elevating platform has an aligning member which is matched with the aligning through hole. The elevating platform is used for matching the aligning through hole corresponding to an object to be aligned to carry out the alignment. The automatic aligning device can improve the alignment efficiency, avoid manmade visual alignment errors and improve the alignment accuracy.
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Description

technical field

[0001] The invention relates to an automatic alignment device, in particular to an automatic alignment device applied to the exposure positioning of a circuit substrate. Background technique

[0002] The production of the conductive circuit of the printed circuit board is to transfer the circuit image preset on the photomask to the photosensitive material such as the dry film on the substrate through the exposure and development process, and then form the required circuit on the substrate through the etching process. line. See literature, Moon-Youn Jung, Won Ick Jang, Chang Auck Choi, Myung Rae Lee, Chi Hoon Jun, Youn Tae Kim; Novel lithography process for extreme deep trench by using laminated negative dry film resist; 2004: 685-688; 2004.17 th IEEE International Conference on Micro Electro Mechanical Systems. During the exposure process, the photomask must be aligned with the substrate to ensure the accuracy of the exposure imaging position and the qualit...

Claims

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