Prediction Method of Grinding Temperature in Ultrasonic Vibration Assisted Grinding of Brittle Materials
A grinding temperature and ultrasonic vibration technology, applied in computer-aided design, geometric CAD, design optimization/simulation, etc., can solve the problems of not considering ultrasonic vibration parameters and unable to reflect processing conditions.
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[0023] In order to illustrate the technical scheme and technical purpose of the present invention, the present invention will be further introduced below in conjunction with the accompanying drawings and specific embodiments.
[0024] combine figure 1 , a method for predicting the grinding temperature of ultrasonic vibration-assisted grinding of brittle materials of the present invention, the specific steps are as follows:
[0025] Step 1, establish the mathematical model of the grinding force F in the grinding process; according to the relationship between the theoretical removal volume and the actual removal volume of the material, the mathematical model of the grinding force for ultrasonic vibration-assisted grinding of brittle materials is calculated as:
[0026]
[0027] In the formula, K is the correction coefficient; K 0 is a dimensionless constant; H V is the Vickers hardness of the workpiece; K IC Fracture toughness of workpiece; C 0 is a dimensionless constant...
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