Cutting Force Prediction Method for Ultrasonic Vibration Side Grinding of Brittle Materials
A technology of cutting force prediction and ultrasonic vibration, which is applied to the control of parts of grinding machine tools, grinding/polishing equipment, and workpiece feed movement, and can solve problems such as not being able to reflect processing conditions
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[0030] In order to better understand the technical content of the present invention, specific embodiments are given together with the attached drawings for description as follows.
[0031] The cutting force prediction method for ultrasonic vibration side grinding of brittle materials of the present invention is suitable for ultrasonic vibration side grinding of brittle materials such as ceramics and glass. In this embodiment, ultrasonic vibration side grinding of zirconia ceramics is taken as an example. Its processing form is as figure 2 As shown, the tool used is a diamond abrasive tool, the tool rotates with the spindle and vibrates at an axial ultrasonic frequency, and the tool performs a feed motion. In the figure, the number 1 represents diamond abrasive grains, the specific parameters of diamond abrasive grain cutters, the main performance parameters and vibration parameters of zirconia ceramics are shown in Table 1 below.
[0032] Table 1
[0033] Grit size...
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